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Volumn , Issue , 2008, Pages

Effects of non-uniform base heating in multi stack microchannel heat sinks used for cooling high heat flux electronic chips and devices

Author keywords

[No Author keywords available]

Indexed keywords

BASE HEATING; COOLANT FLOW; COUNTER-FLOWS; DISCRETIZATIONS; ELECTRONIC CHIPS; ELECTRONIC COMPONENT; ELECTRONIC DEVICE; HEAT REMOVAL; HIGH HEAT FLUX; HOT SPOT; MICRO CHANNEL HEAT SINKS; NONUNIFORM; NONUNIFORM HEATING; UNIFORM HEATING;

EID: 77955104680     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507856     Document Type: Conference Paper
Times cited : (4)

References (8)
  • 1
    • 0019563707 scopus 로고
    • High performance heat sinking for VLSI
    • Tuckerman, D.B. and Pease, R.F., "High performance heat sinking for VLSI", IEEE Electron device letter, EDL-2(4)(1981) pp. 126-129.
    • (1981) IEEE Electron Device Letter , vol.EDL-2 , Issue.4 , pp. 126-129
    • Tuckerman, D.B.1    Pease, R.F.2
  • 2
    • 0001619513 scopus 로고
    • Advances in thermal modeling of electronic components
    • A. Bar-Cohen and A.D. Kraus (Eds.) ASME (New York)
    • Philips, R.J., Advances in thermal modeling of electronic components, in: A. Bar-Cohen and A.D. Kraus (Eds.), Microchannel heat sinks, ASME, (New York, 1990), pp. 109-184.
    • (1990) Microchannel Heat Sinks , pp. 109-184
    • Philips, R.J.1
  • 3
    • 0033457941 scopus 로고    scopus 로고
    • Forced convection in microstructures for electronic equipment cooling
    • Kim, S.J., and Kim, D., "Forced convection in microstructures for electronic equipment cooling", ASME J. Heat Transfer, Vol. 21 (1999) pp. 639-45.
    • (1999) ASME J. Heat Transfer , vol.21 , pp. 639-645
    • Kim, S.J.1    Kim, D.2
  • 4
    • 0342948889 scopus 로고    scopus 로고
    • Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
    • Fedorov, A.G., and Viskanta, R., "Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging". International Journal of Heat and Mass Transfer, R. Vol. 43 (2000), pp. 399-415.
    • (2000) International Journal of Heat and Mass Transfer, R. , vol.43 , pp. 399-415
    • Fedorov, A.G.1    Viskanta, R.2
  • 5
    • 0036776505 scopus 로고    scopus 로고
    • Optimization of single and double layer counter flow MicroChannel heat sinks
    • Chong, S.H., Ooi, K.T., Wong, T.N., "Optimization of Single and Double Layer Counter Flow MicroChannel Heat Sinks", Applied Thermal Engineering, Vol. 22 (2002), pp. 1569-1585.
    • (2002) Applied Thermal Engineering , vol.22 , pp. 1569-1585
    • Chong, S.H.1    Ooi, K.T.2    Wong, T.N.3
  • 6
    • 8744298193 scopus 로고    scopus 로고
    • Stacked microchannel heat sinks for liquid cooling of microelectronic components
    • Wei, X. and Joshi, Y.K., "Stacked microchannel heat sinks for liquid cooling of microelectronic components", ASME Journal of Electronic Packaging, Vol. 126 (2004), pp. 60-65.
    • (2004) ASME Journal of Electronic Packaging , vol.126 , pp. 60-65
    • Wei, X.1    Joshi, Y.K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.