Strip-and-zone micro-channel liquid cooling of integrated circuits chips with non-uniform power distributions

ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013

Volumn 3, Issue , 2013, Pages

  Zhang, Yu ^a   Li, Yubai ^a   Li, Xin ^a   Yao, Shi Chune ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLOW RESISTANCE; HIGH-POWER INTEGRATED CIRCUITS; LIQUID COOLING; MAXIMUM TEMPERATURE; PARALLEL STRIPS; POWER DENSITIES; POWER DISTRIBUTIONS; SURFACE TEMPERATURES;

ATMOSPHERIC TEMPERATURE; COOLING; FUEL CELLS; HEAT FLUX; OPTIMIZATION; SUSTAINABLE DEVELOPMENT;

LIQUIDS;

EID: 84893022173     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/HT2013-17311     Document Type: Conference Paper

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