Dimensional optimization of microchannel heat sinks with multiple heat sources

International Journal of Thermal Sciences

Volumn 62, Issue , 2012, Pages 85-92

  Türkakar, Göker ^a   Okutucu Özyurt, Tuba ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

Author keywords

Analytical optimization; Entrance effects; Hot spot cooling; Microchannel heat sink; Thermal resistance minimization; Variable properties

Indexed keywords

CORE DIMENSION; ENTRANCE EFFECTS; HOT SPOT; HYDRODYNAMIC ENTRANCE REGION; LOAD CONDITION; MICRO CHANNEL HEAT SINKS; MULTIPLE HEAT SOURCES; OUTLET TEMPERATURE; REFERENCE PROCESSORS; SILICON MICROCHANNEL HEAT SINKS; VARIABLE PROPERTY; WEIGHTED AVERAGES;

HEAT SINKS;

OPTIMIZATION;

EID: 84867744225     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2011.12.015     Document Type: Conference Paper

References (15)

1. D.B. Tuckerman, and R.F.W. Pease High performance heat sink for VLSI IEEE Electron Device Letters EDL-2 5 1981 126 129
2. A. Husain, and K.-Y. Kim Shape optimization of micro-channel heat sink for micro-electronic cooling, components and packaging technologies IEEE Transactions 31 2 2008 322 330
3. J. Li, and G.P. Peterson 3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow International Journal of Heat and Mass Transfer 50 15-16 July 2007 2895 2904
4. A. Husain, and K.-Y. Kim Multiobjective optimization of a microchannel heat sink using evolutionary algorithm Journal of Heat Transfer 130 11 November 2008 114505 114513
5. D. Liu, and S.V. Garimella Analysis and optimization of the thermal performance of microchannel heat sinks International Journal of Numerical Methods for Heat & Fluid Flow 15 1 2005 7 26
6. M.N. Sabry Transverse temperature gradient effect on fin efficiency for micro-channel design Journal of Electronic Packaging 123 4 December 2001 344 350
7. Y.S. Muzychka, J.R. Culham, and M.M. Yovanovich Thermal spreading resistance of eccentric heat sources on rectangular flux channels Journal of Electronic Packaging 125 2 June, 2003 178 185
8. V. Sahu, Y.K. Joshi, A.G. Fedorov, Hybrid solid state/fluidic cooling for hotspot removal, Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, 2008, pp. 626-631.
9. P.S. Lee, S.K. Chou, Y.J. Lee, Optimization of the thermal performance of microchannel heat sinks using thermally developing Nusselt number correlation, Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 2008, pp. 545-551.
10. J.H. Ryu, D.H. Choi, and S.J. Kim Numerical optimization of the thermal performance of a microchannel heat sink International Journal of Heat and Mass Transfer 45 13 June 2002 2823 2827
11. A. Husain, and K.-Y. Kim Optimization of a microchannel heat sink with temperature dependent fluid properties Applied Thermal Engineering 28 8-9 June 2008 1101 1107
12. Intel Core i7-900 Desktop Processor Extreme Edition Series Data Sheet. (July 2010). (Volume 1, Data Sheet 1). Retrieved (30 July 2010) from: http://download.intel.com/design/processor/datashts/323252.pdf.
13. G. Türkakar, Numerical Simulation and Analytical Optimization of Microchannel Heat Sinks, M.S. Thesis, August 2010.
14. A. Koyuncuoglu, T. Okutucu, H. Külah, A CMOS compatible metal-polymer microchannel heat sink for monolithic chip cooling applications, in: Proceedings of the 14th International Heat Transfer Conference, IHTC14, August 13th 2010, Washington, DC, USA, IHTC 14-232128.
15. S.G. Kandlikar, S. Garimella, D. Li, S. Colin, and M.R. King Heat Transfer and Fluid Flow in Minichannels and Microchannels 2005 illustrated ed.