Cooling of electronic chips using microchannel and micro-pin fin heat exchangers

Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008

Volumn , Issue PART B, 2008, Pages 1881-1887

  Prasher, Ravi ^a,b   Chang, Je Young ^b  

^a Arizona State University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING OF ELECTRONICS; ELECTRONIC COOLING; ELECTRONIC SYSTEMS; FUTURE TECHNOLOGIES; HIGH EFFICIENCY; HOTSPOTS; LIQUID COOLING; MICRO-SCALES; MICROCHANNEL COOLING; NANO SCALE; NANO-MATERIALS; PIN-FIN HEAT EXCHANGER; RESEARCH COMMUNITIES; TECHNOLOGY DEVELOPMENT; THEORETICAL TECHNIQUE; THERMAL INTERFACE MATERIALS; THERMAL MANAGEMENT; THERMOELECTRIC DEVICES;

COOLING; FINS (HEAT EXCHANGE); HEAT EXCHANGERS; NANOSTRUCTURED MATERIALS; TECHNOLOGICAL FORECASTING;

MICROCHANNELS;

EID: 77952620310     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2008-62384     Document Type: Conference Paper

References (12)

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