Numerical simulation on variable width multi-channels heat sinks with non-uniform heat source

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 1155-1158

  Xiaojing, Wang ^a   Wen, Zhang ^a   Hongjun, Liu ^a   Ling, Chen ^a   Zongshuo, Li ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL WIDTHS; MULTI CHANNEL; NON-UNIFORM HEAT SOURCE; NONUNIFORMITY; NUMERICAL SIMULATION; PACKAGE DIMENSIONS; PACKAGE STRUCTURE; PRESSURE DISTRIBUTING; SIMULATION MODEL; SOFTWARE FLUENT; SURROUNDING REGIONS; TEMPERATURE RISE; VARIABLE WIDTH; VELOCITY RANGE;

COMPUTER SOFTWARE; ELECTRONICS PACKAGING; HEAT SINKS; SIMULATORS; THERMAL LOAD; THERMOANALYSIS;

PACKAGING;

EID: 70449972550     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270609     Document Type: Conference Paper

References (9)

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