Design and optimization of single-phase liquid cooled microchannel heat sink

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 4, 2009, Pages 876-886

  Biswal, Laxmidhar ^a,b   Chakraborty, Suman ^a   Som, S K ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

^b ITPL   (India)

Author keywords

Design; Heat sink; Microchannel; Optimization; Semiconductor; Single phase; Thermal resistance

Indexed keywords

ANALYTICAL METHOD; ANALYTICAL RESULTS; AUTOMOTIVE APPLICATIONS; COOLANT FLOW RATES; DESIGN AND OPTIMIZATION; DESIGN CYCLE-TIME; DESIGN PARAMETERS; ENHANCED COOLING; EXPERIMENTAL DATA; HEAT SINK MATERIALS; HEAT SOURCES; HIGH-POWER DEVICES; LIGHT WEIGHT; LIQUID COOLANT; MICRO CHANNEL HEAT SINKS; ROBUST ANALYTICAL METHODS; SEMICONDUCTOR; SINGLE-PHASE LIQUIDS; SURFACE-TO-VOLUME RATIO; THERMAL RESISTANCE; TIME-TO-MARKET;

ASPECT RATIO; COOLANTS; DESIGN; HEAT SINKS; LIQUIDS; MICROCHANNELS; OPTIMIZATION; PRESSURE DROP; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES;

HEAT RESISTANCE;

EID: 72149097073     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2025598     Document Type: Article

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