A Device-Level Vacuum-Packaging Scheme for Microbolometers on Rigid and Flexible Substrates

IEEE Sensors Journal

Volumn 7, Issue 7, 2007, Pages 1012-1019

  Butler, Donald P ^c   Celik Butler, Zeynep ^c  

^a University of Texas at Arlington   (United States)

^b PURDUE UNIVERSITY   (United States)

^c UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

Author keywords

Bolometer; flexible substrates; packaging; smart skin

Indexed keywords

EID: 85008016956     PISSN: 1530437X     EISSN: 15581748     Source Type: Journal    
DOI: 10.1109/JSEN.2007.896560     Document Type: Article

References (22)

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