Low Temperature Cu Nanorod/Sn/Cu Nanorod Bonding Technology for 3D Integration

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 951-956

  Du, Li ^a   Shi, Tielin ^a   Tang, Zirong ^a   Shen, Junjie ^a   Liao, Guanglan ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION; DIFFUSION IN SOLIDS; ELECTRONIC EQUIPMENT; INTEGRATION; INTERMETALLICS; NANORODS; NETWORK COMPONENTS; TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIN; WAFER BONDING;

BONDING TEMPERATURES; GROWTH OF INTERMETALLICS; LOW TEMPERATURE WAFER BONDING; MORPHOLOGY EVOLUTION; OBLIQUE-ANGLE DEPOSITION; SOLID-STATE DIFFUSION; SYSTEM LEVEL INTEGRATION; THREE DIMENSIONAL INTEGRATION;

COPPER COMPOUNDS;

EID: 84987829324     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.32     Document Type: Conference Paper

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