Three-dimensional integration scheme with a thermal budget below 300 °C

Sensors and Actuators, A: Physical

Volumn 139, Issue 1-2 SPEC. ISS., 2007, Pages 350-355

  Benkart, P ^a   Munding, A ^a   Kaiser, A ^a   Kohn, E ^a   Heittmann, A ^b   Huebner, H ^b   Ramacher, U ^b  

^a UNIVERSITY OF ULM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

3D stacking; Chip stack; Microsystems; Silicon fabrication technology; Through chip via; Vertical integration

Indexed keywords

CMOS INTEGRATED CIRCUITS; EMBEDDED SYSTEMS; LARGE SCALE SYSTEMS; MICROPROCESSOR CHIPS; MICROSYSTEMS;

INTERCONNECT DENSITY; MEMORY CIRCUITS; SILICON FABRICATION TECHNOLOGY; THREE DIMENSIONAL INTEGRATION; VERTICAL INTEGRATION;

ELECTRIC WIRING;

EID: 34548179405     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.04.032     Document Type: Article

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