3-D stacked package technology and trends

Proceedings of the IEEE

Volumn 97, Issue 1, 2009, Pages 31-42

  Carson, Flynn P ^a   Kim, Young Cheol ^b   Yoon, In Sang ^b  

^a STATS ChipPAC Ltd   (United States)

^b STATS ChipPAC Korea Ltd   (South Korea)

Author keywords

Package in package; Package on package; Semiconductor device packaging; Three dimensional packaging

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; PACKAGING; SEMICONDUCTOR DEVICES; SOLDERED JOINTS;

DEVICE TECHNOLOGIES; FINE-PITCH BALL GRID ARRAY PACKAGES; KEY TECHNOLOGIES; PACKAGE ON PACKAGES; SEMICONDUCTOR DEVICE PACKAGING; STACKED PACKAGE; THREE DIMENSIONAL PACKAGING; VERTICAL INTEGRATION;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 61549125628     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2008.2007460     Document Type: Article

References (14)

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