Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealing

Materials Science and Engineering: A

Volumn 371, Issue 1-2, 2004, Pages 65-71

  Zhang, L ^a   Meng, L ^a   Zhou, S P ^b   Yang, F T ^b  

^a ZHEJIANG UNIVERSITY   (China)

^b KUNMING INSTITUTE OF PRECIOUS METALS   (China)

Author keywords

Anneal; Bimetallic laminate; Bond interface; Constituent distribution; Microstructure; Roll

Indexed keywords

ANNEALING; COPPER; DIFFUSION; GRAIN SIZE AND SHAPE; LAMINATES; MICROSTRUCTURE; MIXTURES; ROLL BONDING;

ANNEALING TEMPERATURE; BIMETALLIC LAMINATES; DYNAMIC RECRYSTALLIZATION; STRIP MATRIXES;

SILVER;

LAMINATED MATERIAL;

EID: 16544369019     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(03)00626-9     Document Type: Article

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