메뉴 건너뛰기




Volumn 2002-January, Issue , 2002, Pages 163-168

Simultaneous switching noise and resonance analysis of on-chip power distribution network

Author keywords

Circuit noise; Frequency domain analysis; Network on a chip; Power systems; Resonance; RLC circuits; Sensitivity analysis; Time domain analysis; Very large scale integration; Voltage

Indexed keywords

CIRCUIT SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTRIC POTENTIAL; FREQUENCY DOMAIN ANALYSIS; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUIT TESTING; NETWORKS (CIRCUITS); RESONANCE; SENSITIVITY ANALYSIS; SPICE; STANDBY POWER SYSTEMS; VLSI CIRCUITS;

EID: 84948449947     PISSN: 19483287     EISSN: 19483295     Source Type: Journal    
DOI: 10.1109/ISQED.2002.996723     Document Type: Article
Times cited : (13)

References (16)
  • 2
    • 0032657615 scopus 로고    scopus 로고
    • Analysis of performance impact caused by power supply noise in deep submicron devices
    • New Orleans, LA, June
    • Y.M. Jiang and K.T. Cheng "Analysis of performance impact caused by power supply noise in deep submicron devices, " in Proceedings of 36th ACM/IEEE Design Automation Conference, pp. 766-771, New Orleans, LA, June 1999.
    • (1999) Proceedings of 36th ACM/IEEE Design Automation Conference , pp. 766-771
    • Jiang, Y.M.1    Cheng, K.T.2
  • 3
    • 0032690819 scopus 로고    scopus 로고
    • A floorplan-based planning methodology for power and clock distribution in ASICs
    • New Orleans, LA, June 6-10
    • J.S. Yim S.O. Bae and C.M. Kyung "A floorplan-based planning methodology for power and clock distribution in ASICs, " in Proceedings of 36th ACM/IEEE Design Automation Conference, pp. 766-771, New Orleans, LA, June 6-10 1999.
    • (1999) Proceedings of 36th ACM/IEEE Design Automation Conference , pp. 766-771
    • Yim, J.S.1    Bae, S.O.2    Kyung, C.M.3
  • 6
    • 0026258666 scopus 로고
    • Simultaneous switching ground noise calculation for packaged CMOS devices
    • November
    • R.Senthinathan and J.L.Prince "Simultaneous switching ground noise calculation for packaged CMOS devices, " in IEEE Journal of Solid-State Circuits, vol. 26, no. 11, pp. 1724-1728, November 1991.
    • (1991) IEEE Journal of Solid-State Circuits , vol.26 , Issue.11 , pp. 1724-1728
    • Senthinathan, R.1    Prince, J.L.2
  • 7
    • 0033890420 scopus 로고    scopus 로고
    • An analytical model of simultaneous switching noise in CMOS systems
    • February
    • H.R.Cha and O.K.Kwon "An analytical model of simultaneous switching noise in CMOS systems, " IEEE Trans. on Advanced Packaging, vol. 23, no. 1 pp. 62-68, February 2000.
    • (2000) IEEE Trans. On Advanced Packaging , vol.23 , Issue.1 , pp. 62-68
    • Cha, H.R.1    Kwon, O.K.2
  • 8
  • 10
    • 0032139844 scopus 로고    scopus 로고
    • Resonance and damping in CMOS circuits with on-chip decoupling capacitance
    • Aug
    • P.Larsson "Resonance and damping in CMOS circuits with on-chip decoupling capacitance, " IEEE transactions on Circuits and Systems, vol. 45. no. 8, pp. 998-1012, Aug. 1998.
    • (1998) IEEE Transactions on Circuits and Systems , vol.45 , Issue.8 , pp. 998-1012
    • Larsson, P.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.