Conductivity and Microstructure of Combinatorially Sputter-Deposited Ta-Ti-Al Nitride Thin Films

Chemistry of Materials

Volumn 27, Issue 13, 2015, Pages 4515-4524

  O'Dea, James R ^a   Holtz, Megan E ^a,b   Legard, Anna E ^a,b   Young, Samuel D ^a,b   Burns, Raymond G ^a   Van Wassen, Abigail R ^a   Muller, David A ^a,b   Abruña, Héctor D ^a   DiSalvo, Francis J ^a   Van Dover, R Bruce ^a,b   Marohn, John A ^a  

^a Cornell University ^*  (United States)

^b School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ALUMINUM NITRIDE; ATOMIC FORCE MICROSCOPY; CARBON; CARBON BLACK; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTRON ENERGY LEVELS; ELECTRON ENERGY LOSS SPECTROSCOPY; ELECTRON SCATTERING; ENERGY DISSIPATION; FILMS; FUEL CELLS; LATTICE CONSTANTS; MICROSTRUCTURE; NITRIDES; OXIDATION; OXIDE FILMS; PROTON EXCHANGE MEMBRANE FUEL CELLS (PEMFC); TANTALUM; TITANIUM NITRIDE; X RAY DIFFRACTION;

CONDUCTIVE PROBE ATOMIC FORCE MICROSCOPIES; ELECTRICAL CONDUCTIVITY; HIGH CONDUCTIVITY; HIGH THROUGHPUT SCREENING; LONG TERM DURABILITY; NITRIDE THIN FILMS; ROCK SALT STRUCTURES; TIP INDUCED OXIDATION;

THIN FILMS;

EID: 84937060611     PISSN: 08974756     EISSN: 15205002     Source Type: Journal    
DOI: 10.1021/cm504599s     Document Type: Article

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