Bonding mechanism of lead-free solder and glass plate by ultrasonic assisted soldering method

Materials and Design

Volumn 65, Issue , 2015, Pages 907-913

  Yonekura, Daisuke ^a   Ueki, Tomoyuki ^a   Tokiyasu, Kazushige ^a   Kira, Shuji ^b   Wakabayashi, Toshio ^b  

^a UNIVERSITY OF TOKUSHIMA   (Japan)

^b Japan UNIX Co   (Japan)

Author keywords

Bonding mechanism; Interface; Pb free solder; Ultrasonic assisted soldering

Indexed keywords

CHEMICAL ANALYSIS; CHEMICAL BONDS; GLASS; GLASS BONDING; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INTERFACES (MATERIALS); LEAD METALLOGRAPHY; LEAD-FREE SOLDERS; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ACOUSTIC CAVITATIONS; BONDING BEHAVIOR; BONDING MECHANISM; CHEMICAL BONDINGS; COMPONENT ELEMENTS; INTERMETALLIC COMPOUND LAYER; OXYGEN CONCENTRATIONS; SOLDERING PROCESS;

SOLDERING;

EID: 84918814965     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2014.10.024     Document Type: Article

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