Effects of bonding temperature and pressure on the electrical resistance of Cu/Sn/Cu joints for 3D integration applications

Journal of Electronic Materials

Volumn 40, Issue 3, 2011, Pages 324-329

  Lee, Byunghoon ^a   Park, Jongseo ^a   Song, Junghyun ^a   Kwon, Kee Won ^a   Lee, Hoo Jeong ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

3D integration; Cu; electrical resistance; joint material; phase transformation; tin

Indexed keywords

3-D INTEGRATION; CU; ELECTRICAL RESISTANCE; JOINT MATERIAL; PHASE TRANSFORMATION;

ELECTRON PROBE MICROANALYSIS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; THREE DIMENSIONAL; TIN; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRIC RESISTANCE;

EID: 79952195254     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1460-5     Document Type: Article

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