Modeling a copper/carbon nanotube composite for applications in electronic packaging

Computational Materials Science

Volumn 97, Issue , 2015, Pages 1-5

  Feng, Ying ^a   Burkett, Susan L ^a  

^a University of Alabama   (United States)

Author keywords

Copper carbon nanotube composite; Current density; Electronic packaging; Modeling; Through silicon vias

Indexed keywords

COPPER; CURRENT DENSITY; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; MODELS; NANOTUBES; SINGLE-WALLED CARBON NANOTUBES (SWCN); THREE DIMENSIONAL INTEGRATED CIRCUITS;

ALIGNED CARBON NANOTUBE BUNDLES; CURRENT DISTRIBUTION; ELECTRONIC PACKAGING; INTERCONNECT APPLICATIONS; MULTI-WALLED CARBON NANOTUBE BUNDLES; NANOTUBE COMPOSITES; SINGLE-WALLED CARBON NANOTUBE BUNDLE; THROUGH SILICON VIAS;

MULTIWALLED CARBON NANOTUBES (MWCN);

EID: 84908320526     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2014.10.014     Document Type: Article

References (28)

1. P. Ramm, M.J. Wolf, A. Klumpp, R. Wieland, B. Wunderle, B. Michel, H. Reichl, Through silicon via technology-processes and reliability for wafer-level 3D system integration, in: Proc. Elec. Comp. Tech. Conf., 2008, pp. 841-846.
2. J.R. Lloyd, and J.J. Clement Thin Solid Films 262 1-2 1995 135 141
3. C. Yang, P.C.H. Chan, F. Yunyi, Y.C. Chuang, and C.Y. Liu IEEE Electron Device Lett. 29 9 2008 1001 1003
4. C.S. Hau-Riege Microelectron. Reliab. 44 2 2004 195 205
5. B.Q. Wei, R. Vajtai, and P.M. Ajayan Appl. Phys. Lett. 79 8 2001 1172 1174
6. F. Kreupl, A.P. Graham, G.S. Duesberg, W. Steinhögl, M. Liebau, E. Unger, and W. Hönlein Microelectron. Eng. 64 1-4 2002 399 408
7. Y. Chai, P.C. Chan, Y. Fu, Y.C. Chuang, C. Liu, Copper/carbon nanotube composite interconnect for enhanced electromigration resistance, in: Proc. Elec. Comp. Tech. Conf., 2008, pp. 412-420.
8. C. Subramaniam, T. Yamada, K. Kobashi, A. Sekiguchi, D.N. Futaba, M. Yumura, and K. Hata Nat. Commun. 4 2013 2202 2208
9. A.G. Chiariello, A. Maffucci, G. Miano, Electrical behaviour of carbon nanotube through-silicon vias, in: Proc. IEEE Workshop on Signal Propagation on Interconnects, 2011, pp. 75-78.
10. C. Xu, H. Li, R. Suaya, and K. Banerjee IEEE Trans. Electron Devices 57 12 2010 3405 3417
11. B.C. Kim, S. Kannan, A. Gupta, F. Mohammed, and B. Ahn J. Nanotechnol. Eng. Med. 1 2 2010 021012
12. N. Srivastava, K. Banerjee, Performance analysis of carbon nanotube interconnects for VLSI applications, in: Proc. IEEE/ACM Int. Conf. on Computer-Aided Design, 2005, pp. 383-390.
13. J. Tao, N.W. Cheung, and H. Chenming IEEE Electron Device Lett. 14 5 1993 249 251
14. J. Robertson, G. Zhong, S. Hofmann, B.C. Bayer, C.S. Esconjauregui, H. Telg, and C. Thomsen Diam. Relat. Mater. 18 5-8 2009 957 962
15. J.S. Suh, and J.S. Lee Appl. Phys. Lett. 75 14 1999 2047 2049
16. R. Xie, C. Zhang, M.H. van der Veen, K. Arstila, T. Hantschel, B. Chen, and J. Robertson Nanotechnology 24 12 2013 125603
17. T. Wang, S. Chen, J. Di, Y. Fu, K. Jeppson, L. Ye, and J. Liu IEEE Electron Device Lett. 33 3 Jan. 2012 420 422
18. A. Naeemi, and J.D. Meindl Performance Modeling for Carbon Nanotube Interconnects A. Avey, J. Kong, Carbon Nanotube Electronics 2009 Springer New York, NY 163 190
19. S. Sakurai, M. Inaguma, D.N. Futaba, M. Yumura, and K. Hata Small 9 21 2013 3584 3592
20. S. Sato, M. Nihei, A. Mimura, A. Kawabata, D. Kondo, H. Shioya, T. Iwai, M. Mishima, M. Ohfuti, Y. Awano, Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles, in: Proc. Int. Interconnect Tech. Conf., 2006, pp. 230-232.
21. L. Cadix, C. Fuchs, M. Rousseau, P. Leduc, H. Chaabouni, A. Thuaire, M. Brocard, A. Valentian, A. Farcy, C. Bermond, N. Sillon, P. Ancey, and B. Fléchet ECS Trans. 33 12 2010 1 21
22. A.G. Chiariello, A. Maffucci, G. Miano, and F. Villone Carbon Nanotubes Interconnects for Nanoelectronics Circuits J.M. Marulanda, Carbon Nanotubes 2010 In-Tech Vukovar, Croatia 251 274
23. G. Miano, C. Forestiere, A. Maffucci, S.A. Maksimenko, and G.Y. Slepyan IEEE Trans. Nanotechnol. 10 1 Jan. 2011 135 149
24. M. D'Amore, M. S. Sarto, A.G. D'Aloia, Skin-effect modeling of carbon nanotube bundles: the high-frequency effective impedance, in: Proc. IEEE Int. Symposium on EMC, 2010, pp. 847-852.
25. L. Hong, and K. Banerjee IEEE IEDM 2008 1 4
26. D.K. Singh, P.K. Iyer, and P.K. Giri J. Appl. Phys. 108 8 Oct. 2010 084313
27. D.K. Singh, P.K. Iyer, and P.K. Giri Diam. Relat. Mater. 19 10 Oct. 2010 1281 1288
28. A.G. Chiariello, A.G. Chiariello, G. Miano, G. Miano, A. Maffucci, A. Maffucci, Size and temperature effects on the resistance of copper and carbon nanotubes nano-interconnects, in: Proc. IEEE 19th Conf. on Elect. Performance of Electron. Package Syst., 2010, pp. 97-100.