Size and temperature effects on the resistance of copper and carbon nanotubes nano-interconnects

2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

Volumn , Issue , 2010, Pages 97-100

  Chiariello, Andrea G ^a   Miano, Giovanni ^a   Maffucci, Antonio ^b  

^a UNIVERSITY OF NAPLES FEDERICO II   (Italy)

^b UNIVERSITY OF CASSINO AND SOUTHERN LAZIO   (Italy)

Author keywords

Carbon nanotubes; Interconnects; Nanoelectronics

Indexed keywords

COPPER; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; NANOELECTRONICS; OPTICAL INTERCONNECTS;

CARBON NANOTUBE INTERCONNECTS; CASE-STUDIES; ELECTRICAL PERFORMANCE; ELECTRICAL RESISTANCES; NANOINTERCONNECTS; SEMI-ANALYTICAL MODEL; TECHNOLOGY NODES; TEMPERATURE CHANGES;

CARBON NANOTUBES;

EID: 78650935171     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2010.5642555     Document Type: Conference Paper

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