Mechanical properties of Cu electroplated in supercritical CO2 emulsion evaluated by micro-compression test

Microelectronic Engineering

Volumn 121, Issue , 2014, Pages 83-86

  Kinashi, Hikaru ^a   Nagoshi, Takashi ^a   Chang, Tso Fu Mark ^a   Sato, Tatsuo ^a   Sone, Masato ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Cu; Electroplating; Micro compression

Indexed keywords

CARBON DIOXIDE; COMPRESSION TESTING; COPPER; EMISSION SPECTROSCOPY; EMULSIFICATION; FABRICATION; GLOW DISCHARGES; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; METALLIC FILMS;

COPPER SULFATE; GLOW-DISCHARGE OPTICAL EMISSION SPECTROSCOPY; GRAIN REFINEMENT STRENGTHENING; IMPURITY CONCENTRATION; MICRO COMPRESSIONS; REFINED MICROSTRUCTURE; SCANNING ION MICROSCOPY; SUPERCRITICAL CO;

ELECTROPLATING;

EID: 84899101369     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2014.03.029     Document Type: Article

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