SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 111, Issue , 2013, Pages 118-121

Micro-compression test using non-tapered micro-pillar of electrodeposited Cu

(5) Mutoh, Masahide a Nagoshi, Takashi a Chang, Tso Fu Mark a Sato, Tatsuo a Sone, Masato a

a TOKYO INSTITUTE OF TECHNOLOGY (Japan)

Author keywords

Copper; Electrodeposition; Micro compression; Size effect

Indexed keywords

COMPRESSION TESTING; CORROSION; ELECTRODEPOSITION; ELECTRODES; ION BEAMS; METALLIC FILMS;

CONTROLLING CURRENT; ELECTRODEPOSITION CONDITIONS; ELECTRON BACK SCATTER DIFFRACTION; FOCUSED ION BEAM MILLING; MICRO COMPRESSIONS; MICRO PILLARS; MICRO-SIZED SPECIMENS; SIZE EFFECTS;

COPPER;

EID: 84885172152 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2013.02.040 Document Type: Article

Times cited : (20)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.