Effect of carbon content on the electrical resistivity of electrodeposited copper

Electrochemical and Solid-State Letters

Volumn 12, Issue 3, 2009, Pages

  Osaka, Tetsuya ^a   Yamachika, Noriyuki ^a   Yoshino, Masahiro ^a   Hasegawa, Madoka ^a   Negishi, Yoshinori ^a   Okinaka, Yutaka ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; COPPER PLATING; CORROSION; ELECTRIC RESISTANCE;

ACID SULFATES; ANNEALING EFFECTS; CARBON CONTENTS; CONVENTIONAL ADDITIVES; COPPER FILMS; DAMASCENE PROCESSES; DEPOSITED STATES; ELECTRICAL RESISTIVITIES; ELECTRODEPOSITED COPPERS; INTER-CONNECTS; RESISTIVITY VALUES; SCANNING ION MICROSCOPES; ULTRA-LARGE-SCALE INTEGRATIONS;

CARBON FILMS;

EID: 58149479701     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3054273     Document Type: Article

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