메뉴 건너뛰기




Volumn 62, Issue 2, 2014, Pages 791-802

Constructal design and thermal analysis of microchannel heat sinks with multistage bifurcations in single-phase liquid flow

Author keywords

Laminar flow; Microchannel heat sink; Multistage bifurcations; Numerical simulation; Thermal performance

Indexed keywords

BIFURCATION (MATHEMATICS); COMPUTATION THEORY; COMPUTER SIMULATION; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; LAMINAR FLOW; MICROCHANNELS; REYNOLDS NUMBER; THERMOANALYSIS;

EID: 84896463662     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2013.10.042     Document Type: Article
Times cited : (166)

References (30)
  • 2
    • 0344946483 scopus 로고    scopus 로고
    • Evolution of microchannel flow passages: Thermohydraulic performance and fabrication technology
    • S.G. Kandlikar, and W.J. Grande Evolution of microchannel flow passages: thermohydraulic performance and fabrication technology Heat Transfer Eng. 24 1 2003 3 17
    • (2003) Heat Transfer Eng. , vol.24 , Issue.1 , pp. 3-17
    • Kandlikar, S.G.1    Grande, W.J.2
  • 3
    • 10444249568 scopus 로고    scopus 로고
    • Evaluation of single phase flow in microchannels for high flux chip cooling - Thermohydraulic performance enhancement and fabrication technology
    • S.G. Kandlikar, and W.J. Grande Evaluation of single phase flow in microchannels for high flux chip cooling - thermohydraulic performance enhancement and fabrication technology Heat Transfer Eng. 25 8 2004 5 16
    • (2004) Heat Transfer Eng. , vol.25 , Issue.8 , pp. 5-16
    • Kandlikar, S.G.1    Grande, W.J.2
  • 4
    • 16544377463 scopus 로고    scopus 로고
    • Challenges in electronic cooling - Opportunities for enhanced thermal management techniques - Microprocessor liquid cooled minichannel heat sink
    • R. Schmidt Challenges in electronic cooling - opportunities for enhanced thermal management techniques - microprocessor liquid cooled minichannel heat sink Heat Transfer Eng. 25 3 2004 3 12
    • (2004) Heat Transfer Eng. , vol.25 , Issue.3 , pp. 3-12
    • Schmidt, R.1
  • 5
    • 83455264462 scopus 로고    scopus 로고
    • A review of recent advances in thermal management in three dimensional chip stacks in electronic systems
    • paper no. 040011
    • V. Venkatadri, B. Sammakia, K. Srihari, and D. Santos A review of recent advances in thermal management in three dimensional chip stacks in electronic systems ASME J. Electron. Packag. 133 2011 paper no. 040011
    • (2011) ASME J. Electron. Packag. , vol.133
    • Venkatadri, V.1    Sammakia, B.2    Srihari, K.3    Santos, D.4
  • 6
    • 0037193313 scopus 로고    scopus 로고
    • Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink
    • DOI 10.1016/S0017-9310(01)00337-4, PII S0017931001003374
    • W. Qu, and I. Mudawar Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink Int. J. Heat Mass Transfer 45 2002 2549 2565 (Pubitemid 34580357)
    • (2002) International Journal of Heat and Mass Transfer , vol.45 , Issue.12 , pp. 2549-2565
    • Qu, W.1    Mudawar, I.2
  • 7
    • 38749100969 scopus 로고    scopus 로고
    • Numerical study of turbulent heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink
    • DOI 10.1115/1.2753887
    • X.L. Xie, W.Q. Tao, and Y.L. He Numerical study of turbulent heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink ASME J. Electron. Packag. 129 2007 247 255 (Pubitemid 351184023)
    • (2007) Journal of Electronic Packaging, Transactions of the ASME , vol.129 , Issue.3 , pp. 247-255
    • Xie, X.L.1    Tao, W.Q.2    He, Y.L.3
  • 8
    • 53549092518 scopus 로고    scopus 로고
    • Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink
    • X.L. Xie, Z.J. Liu, Y.L. He, and W.Q. Tao Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink Appl. Therm. Eng. 29 2009 64 74
    • (2009) Appl. Therm. Eng. , vol.29 , pp. 64-74
    • Xie, X.L.1    Liu, Z.J.2    He, Y.L.3    Tao, W.Q.4
  • 10
    • 84872035698 scopus 로고    scopus 로고
    • Analysis of flow and thermal performance of a water-cooled transversal wavy microchannel heat sink for chip cooling
    • paper no. 041010
    • G.N. Xie, J. Liu, W.H. Zhang, and B. Sunden Analysis of flow and thermal performance of a water-cooled transversal wavy microchannel heat sink for chip cooling ASME J. Electron. Packag. 134 2012 paper no. 041010
    • (2012) ASME J. Electron. Packag. , vol.134
    • Xie, G.N.1    Liu, J.2    Zhang, W.H.3    Sunden, B.4
  • 11
    • 84878573167 scopus 로고    scopus 로고
    • Comparative study of thermal performance of longitudinal and transversal wavy microchannel heat sinks for electronic cooling
    • paper no. 021008
    • G.N. Xie, J. Liu, Y.Q. Liu, B. Sunden, and W.H. Zhang Comparative study of thermal performance of longitudinal and transversal wavy microchannel heat sinks for electronic cooling ASME J. Electron. Packag. 135 2013 paper no. 021008
    • (2013) ASME J. Electron. Packag. , vol.135
    • Xie, G.N.1    Liu, J.2    Liu, Y.Q.3    Sunden, B.4    Zhang, W.H.5
  • 12
    • 0022739612 scopus 로고
    • Laminar forced convective heat transfer in a two-diemnsional 90 degree bifurcation
    • J.M. Khodadadi, T.M. Nguyen, and N.S. Vlachos Laminar forced convective heat transfer in a two-dimensional 90 bifurcation Numer. Heat Transfer Part A 9 1986 677 695 (Pubitemid 16604100)
    • (1986) Numerical heat transfer , vol.9 , Issue.6 , pp. 677-695
    • Khodadadi, J.M.1    Nguyen, T.M.2    Vlachos, N.S.3
  • 13
    • 0024928776 scopus 로고
    • Incompressible flow through multiple passages
    • Y. Nakamura, W. Jia, and M. Yasuhara Incompressible flow through multiple passages Numer. Heat Transfer Part A 16 1989 451 465 (Pubitemid 20634113)
    • (1989) Numerical heat transfer , vol.16 , Issue.4 , pp. 451-465
    • Nakamura, Y.1    Jia, W.2    Yasuhara, M.3
  • 14
    • 0032119070 scopus 로고    scopus 로고
    • Numerical calculation of turbulent flow in a planar bifurcation with a protruding branching duct
    • Y.T. Yang, and T.Y. Tsai Numerical calculation of turbulent flow in a planar bifurcation with a protruding branching duct Numer. Heat Transfer Part A 34 1998 61 74
    • (1998) Numer. Heat Transfer Part A , vol.34 , pp. 61-74
    • Yang, Y.T.1    Tsai, T.Y.2
  • 15
    • 27644451121 scopus 로고    scopus 로고
    • Tree-shaped flow architectures: Strategies for increasing optimization speed and accuracy
    • DOI 10.1080/10407780500197707
    • W. Wechsatol, A. Bejan, and S. Lorente Tree-shaped flow architectures: strategies for increasing optimization speed and accuracy Numer. Heat Transfer Part A 48 2005 731 744 (Pubitemid 41562006)
    • (2005) Numerical Heat Transfer; Part A: Applications , vol.48 , Issue.8 , pp. 731-744
    • Wechsatol, W.1    Bejan, A.2    Lorente, S.3
  • 18
    • 4544245917 scopus 로고    scopus 로고
    • Maximal heat transfer density: Plates with multiple lengths in forced convection
    • T. Bello-Ochende, and A. Bejan Maximal heat transfer density: plates with multiple lengths in forced convection Int. J. Therm. Sci. 43 2004 1181 1186
    • (2004) Int. J. Therm. Sci. , vol.43 , pp. 1181-1186
    • Bello-Ochende, T.1    Bejan, A.2
  • 19
    • 58149378158 scopus 로고    scopus 로고
    • Constructal design of T-Y assembly of fins for an optimized heat removal
    • G. Lorenzini, and L.A.O. Rocha Constructal design of T-Y assembly of fins for an optimized heat removal Int. J. Heat Mass Transfer 52 2009 1458 1463
    • (2009) Int. J. Heat Mass Transfer , vol.52 , pp. 1458-1463
    • Lorenzini, G.1    Rocha, L.A.O.2
  • 20
    • 84860511969 scopus 로고    scopus 로고
    • Combined experimental and numerical study for multiple microchannel heat transfer system
    • Washington, USA, Paper no. IHTC2010-22235
    • J.R. Zhang, Y. Jaluria, T.T. Zhang, and L. Jia Combined experimental and numerical study for multiple microchannel heat transfer system Proceedings of the 14th International Heat Transfer Conference August 8-13, 2012 Washington, USA, Paper no. IHTC2010-22235
    • (2012) Proceedings of the 14th International Heat Transfer Conference
    • Zhang, J.R.1    Jaluria, Y.2    Zhang, T.T.3    Jia, L.4
  • 22
    • 33747878085 scopus 로고    scopus 로고
    • Thermal characteristics of tree-shaped microchannel nets for cooling of a rectangular heat sink
    • DOI 10.1016/j.ijthermalsci.2006.01.010, PII S1290072906000214
    • X.Q. Wang, A.S. Mujumdar, and C. Yap Thermal characteristics of tree-shaped microchannel nets for cooling of a rectangular heat sink Int. J. Therm. Sci. 45 2006 1103 1112 (Pubitemid 44293447)
    • (2006) International Journal of Thermal Sciences , vol.45 , Issue.11 , pp. 1103-1112
    • Wang, X.-Q.1    Mujumdar, A.S.2    Yap, C.3
  • 23
    • 71649089104 scopus 로고    scopus 로고
    • Flow and thermal characteristics of offset branching network
    • X.Q. Wang, P. Xu, A.S. Mujumdar, and C. Yap Flow and thermal characteristics of offset branching network Int. J. Therm. Sci. 49 2010 272 280
    • (2010) Int. J. Therm. Sci. , vol.49 , pp. 272-280
    • Wang, X.Q.1    Xu, P.2    Mujumdar, A.S.3    Yap, C.4
  • 24
    • 84884485221 scopus 로고    scopus 로고
    • Numerical analysis of flow and thermal performance of liquid-cooling microchannel heat sinks with bifurcation
    • G.N. Xie, Z.Y. Chen, B. Sunden, and W.H. Zhang Numerical analysis of flow and thermal performance of liquid-cooling microchannel heat sinks with bifurcation Numer. Heat Transfer Part A 64 2013 902 919
    • (2013) Numer. Heat Transfer Part A , vol.64 , pp. 902-919
    • Xie, G.N.1    Chen, Z.Y.2    Sunden, B.3    Zhang, W.H.4
  • 25
    • 17644411021 scopus 로고    scopus 로고
    • Investigation of heat transfer in rectangular microchannels
    • DOI 10.1016/j.ijheatmasstransfer.2004.11.019, PII S0017931005000074
    • P.S. Lee, S.V. Garimella, and D. Liu Investigation of heat transfer in rectangular microchannels Int. J. Heat Mass Transfer 48 2005 1688 1704 (Pubitemid 40572468)
    • (2005) International Journal of Heat and Mass Transfer , vol.48 , Issue.9 , pp. 1688-1704
    • Lee, P.-S.1    Garimella, S.V.2    Liu, D.3
  • 27
    • 5644275469 scopus 로고    scopus 로고
    • Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink
    • X.L. Yu, J.M. Feng, Q.K. Feng, and Q.W. Wang Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink Appl. Therm. Eng. 23 2005 173 182
    • (2005) Appl. Therm. Eng. , vol.23 , pp. 173-182
    • Yu, X.L.1    Feng, J.M.2    Feng, Q.K.3    Wang, Q.W.4
  • 30
    • 84862751977 scopus 로고    scopus 로고
    • Numerical simulation of the thermal hydraulic performance of a plate pin fin heat sink
    • W.H. Yuan, J.Y. Zhao, C.P. Tso, T.H. Wu, W. Liu, and T.Z. Ming Numerical simulation of the thermal hydraulic performance of a plate pin fin heat sink Appl. Therm. Eng. 48 2012 81 88
    • (2012) Appl. Therm. Eng. , vol.48 , pp. 81-88
    • Yuan, W.H.1    Zhao, J.Y.2    Tso, C.P.3    Wu, T.H.4    Liu, W.5    Ming, T.Z.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.