Numerical analysis of novel micro pin fin heat sink with variable fin density

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 5, 2012, Pages 825-833

  Rubio Jimenez, Carlos A ^a   Kandlikar, Satish G ^a   Hernandez Guerrero, Abel ^b  

^a Kate Gleason College of Engineering   (United States)

^b UNIVERSITY OF GUANAJUATO   (Mexico)

Author keywords

Micro pin fin heat sink; single phase flow; uniform junction temperature; variable fin density

Indexed keywords

BOTTOM WALL; COOLING DEVICES; FIN DENSITY; FIN LENGTH; FIN SHAPE; HEAT SINK DESIGN; HEAT TRANSFER AREA; IC CHIPS; JUNCTION TEMPERATURES; LAMINAR REGIME; NOVEL DESIGN; PIN FIN HEAT SINKS; SINGLE-PHASE FLOW; UNIFORM TEMPERATURE;

FINS (HEAT EXCHANGE); NUMERICAL ANALYSIS; PRESSURE DROP; THERMAL GRADIENTS;

DESIGN;

EID: 84860881810     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2189925     Document Type: Article

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