메뉴 건너뛰기




Volumn 29, Issue 1, 2009, Pages 64-74

Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink

Author keywords

Heat sink; Heat transfer; Minichannel; Numerical study; Pressure drop

Indexed keywords

AIR; FLUID MECHANICS; HEATING EQUIPMENT; INTEGRATED CIRCUITS; NUMERICAL ANALYSIS;

EID: 53549092518     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2008.02.002     Document Type: Article
Times cited : (265)

References (30)
  • 2
    • 53549115149 scopus 로고    scopus 로고
    • R.J. Philips, Forced convection, liquid cooled, microchannel heat sinks, M.S. Thesis, Department of Mechanical Engineering, Massechussetts Institute of Technology, Cambridge, 1987.
    • R.J. Philips, Forced convection, liquid cooled, microchannel heat sinks, M.S. Thesis, Department of Mechanical Engineering, Massechussetts Institute of Technology, Cambridge, 1987.
  • 3
    • 4544365291 scopus 로고    scopus 로고
    • S.G. Kandlikar, H.R. Upadhye, Optimization of microchannel geometry for direct chip cooling using single-phase transfer, in: Proceedings of Microchannels and Minichannels-2004, ASME, NY, 2004, pp. 679-614.
    • S.G. Kandlikar, H.R. Upadhye, Optimization of microchannel geometry for direct chip cooling using single-phase transfer, in: Proceedings of Microchannels and Minichannels-2004, ASME, NY, 2004, pp. 679-614.
  • 4
    • 4544301461 scopus 로고    scopus 로고
    • S.G. Kandlikar, W.J. Grande, Evaluation of single-phase flow in microchannels for high flux CHIP cooling - thermohydraulic performance enhancement and fabrication technology, in: Proceedings of Microchannels and Minichannels-2004, ASME, NY, 2004, pp. 67-76.
    • S.G. Kandlikar, W.J. Grande, Evaluation of single-phase flow in microchannels for high flux CHIP cooling - thermohydraulic performance enhancement and fabrication technology, in: Proceedings of Microchannels and Minichannels-2004, ASME, NY, 2004, pp. 67-76.
  • 5
    • 53549111137 scopus 로고    scopus 로고
    • S.G. Kandlikar, High flux heat removal with microchannels - a roadmap of challenges and opportunities, in: Proceedings of Microchannels and Minichannels-2005, ASME, Toronto, 2005, pp. 1-10.
    • S.G. Kandlikar, High flux heat removal with microchannels - a roadmap of challenges and opportunities, in: Proceedings of Microchannels and Minichannels-2005, ASME, Toronto, 2005, pp. 1-10.
  • 6
    • 2142651642 scopus 로고    scopus 로고
    • Heat transfer mechanisms during flow boiling in microchannels
    • Kandlikar S.G. Heat transfer mechanisms during flow boiling in microchannels. J. Heat Transfer 126 (2004) 8-16
    • (2004) J. Heat Transfer , vol.126 , pp. 8-16
    • Kandlikar, S.G.1
  • 7
    • 2942714848 scopus 로고    scopus 로고
    • Mini- and microchannels: influence of axial conduction in the walls
    • Gael M., Isabelle P., and Denis M. Mini- and microchannels: influence of axial conduction in the walls. Int. J. Heat Mass Transfer 47 (2004) 3993-4004
    • (2004) Int. J. Heat Mass Transfer , vol.47 , pp. 3993-4004
    • Gael, M.1    Isabelle, P.2    Denis, M.3
  • 8
    • 53549125068 scopus 로고    scopus 로고
    • D.J. Schmitt, Experimental investigation of surface roughness microstructures and their effects on pressure drop characteristics in rectangular minichannels, M.S. Thesis, Department of Mechanical Engineering, Rochester Institute of Technology, 2004.
    • D.J. Schmitt, Experimental investigation of surface roughness microstructures and their effects on pressure drop characteristics in rectangular minichannels, M.S. Thesis, Department of Mechanical Engineering, Rochester Institute of Technology, 2004.
  • 9
    • 53549129569 scopus 로고    scopus 로고
    • D.J. Schmitt, S.G. Kandlikar, Effects of repeating microstructures on pressure in rectangular minichannels, in: Third International Conference on Microchannels and Minichannels, Toronto, Canada, 2004, June 13-15.
    • D.J. Schmitt, S.G. Kandlikar, Effects of repeating microstructures on pressure in rectangular minichannels, in: Third International Conference on Microchannels and Minichannels, Toronto, Canada, 2004, June 13-15.
  • 10
    • 0141746036 scopus 로고    scopus 로고
    • Size effect on microscale single-phase flow and heat transfer
    • Guo Z.Y., and Li Z.X. Size effect on microscale single-phase flow and heat transfer. Int. J. Heat Mass Transfer 46 (2003) 149-159
    • (2003) Int. J. Heat Mass Transfer , vol.46 , pp. 149-159
    • Guo, Z.Y.1    Li, Z.X.2
  • 11
    • 34247480473 scopus 로고    scopus 로고
    • Experimental and numerical studies of liquid flow and heat transfer in microtubes
    • Li Z., He Y.L., Tang G.H., and Tao W.Q. Experimental and numerical studies of liquid flow and heat transfer in microtubes. Int. J. Heat Mass Transfer 50 (2007) 3447-3460
    • (2007) Int. J. Heat Mass Transfer , vol.50 , pp. 3447-3460
    • Li, Z.1    He, Y.L.2    Tang, G.H.3    Tao, W.Q.4
  • 12
    • 0036838388 scopus 로고    scopus 로고
    • Scale effects on hydrodynamics and heat transfer in two-dimensional mini and microchannels
    • Gao P.Z., Person S.L., and Favre-Marinet M. Scale effects on hydrodynamics and heat transfer in two-dimensional mini and microchannels. Int. J. Therm. Sci. 41 (2002) 1017-1027
    • (2002) Int. J. Therm. Sci. , vol.41 , pp. 1017-1027
    • Gao, P.Z.1    Person, S.L.2    Favre-Marinet, M.3
  • 13
    • 3142539273 scopus 로고    scopus 로고
    • Friction performance of highly viscous fluid in minichannels
    • Wang C.C., Jeng Y.R., Chien J.J., and Chang Y.J. Friction performance of highly viscous fluid in minichannels. Appl. Therm. Eng. 24 (2004) 2243-2250
    • (2004) Appl. Therm. Eng. , vol.24 , pp. 2243-2250
    • Wang, C.C.1    Jeng, Y.R.2    Chien, J.J.3    Chang, Y.J.4
  • 14
    • 0036836627 scopus 로고    scopus 로고
    • Friction factor and heat transfer coefficient of R134a liquid flow in minichannels
    • Agostini B., Watel B., Bontemps A., and Thonon B. Friction factor and heat transfer coefficient of R134a liquid flow in minichannels. Appl. Therm. Eng. 22 (2002) 1821-1834
    • (2002) Appl. Therm. Eng. , vol.22 , pp. 1821-1834
    • Agostini, B.1    Watel, B.2    Bontemps, A.3    Thonon, B.4
  • 15
    • 0036650277 scopus 로고    scopus 로고
    • Single and two-phase pressure drop characteristics in miniature helical channels
    • Downing R.S., and Kojasoy G. Single and two-phase pressure drop characteristics in miniature helical channels. Exp. Therm. Fluid Sci. 26 (2002) 535-546
    • (2002) Exp. Therm. Fluid Sci. , vol.26 , pp. 535-546
    • Downing, R.S.1    Kojasoy, G.2
  • 16
    • 53549108402 scopus 로고    scopus 로고
    • R.S. Downing, Analytical and experimental study of single and two-phase cooling in miniature straight and helical channels, Ph.D. Thesis, Department of Mechanical Engineering, University of Wisconsin-Milwaukee, 1999.
    • R.S. Downing, Analytical and experimental study of single and two-phase cooling in miniature straight and helical channels, Ph.D. Thesis, Department of Mechanical Engineering, University of Wisconsin-Milwaukee, 1999.
  • 17
    • 0035486101 scopus 로고    scopus 로고
    • Measurement of forced convection heat transfer coefficients in minichannels
    • Debray F., Franc J.P., Maitre T., and Reynaud S. Measurement of forced convection heat transfer coefficients in minichannels. Mec. Ind. 2 (2001) 443-454
    • (2001) Mec. Ind. , vol.2 , pp. 443-454
    • Debray, F.1    Franc, J.P.2    Maitre, T.3    Reynaud, S.4
  • 18
  • 19
    • 12344249809 scopus 로고    scopus 로고
    • Multi-physics simulation of a microprocessor package under water cooling
    • Liu B.M., and Mui Y. Multi-physics simulation of a microprocessor package under water cooling. ASME J. Electron. Packaging 126 (2004) 384-389
    • (2004) ASME J. Electron. Packaging , vol.126 , pp. 384-389
    • Liu, B.M.1    Mui, Y.2
  • 20
    • 1242331461 scopus 로고    scopus 로고
    • R. Schmidt, Challenges in electronic cooling - opportunities for enhanced - thermal management techniques - microprocessor liquid cooled minichannel heat sink, in: First International Conference on Microchannels and Minichannels, Rochester, NY, 2003, April 24-25.
    • R. Schmidt, Challenges in electronic cooling - opportunities for enhanced - thermal management techniques - microprocessor liquid cooled minichannel heat sink, in: First International Conference on Microchannels and Minichannels, Rochester, NY, 2003, April 24-25.
  • 21
    • 53549114572 scopus 로고    scopus 로고
    • K. Yazawa, M. Ishizuka, A study of channel optimization in cooling spreader on a smaller and transient heat source, in: Proceedings of Fifth International Conference on Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology, Engineering Conferences International, Hoboken, NJ, USA, 2005, September.
    • K. Yazawa, M. Ishizuka, A study of channel optimization in cooling spreader on a smaller and transient heat source, in: Proceedings of Fifth International Conference on Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology, Engineering Conferences International, Hoboken, NJ, USA, 2005, September.
  • 24
    • 0036801314 scopus 로고    scopus 로고
    • A new stability-guaranteed second-order difference scheme
    • Li Z.Y., and Tao W.Q. A new stability-guaranteed second-order difference scheme. Numer. Heat Transfer - Part B 42 4 (2002) 349-365
    • (2002) Numer. Heat Transfer - Part B , vol.42 , Issue.4 , pp. 349-365
    • Li, Z.Y.1    Tao, W.Q.2
  • 25
    • 10644236330 scopus 로고    scopus 로고
    • Three-dimensional numerical simulation on laminar heat transfer and fluid flow characteristics of strip fin surfaces with X-arrangement of strips
    • Qu Z.G., Tao W.Q., and He Y.L. Three-dimensional numerical simulation on laminar heat transfer and fluid flow characteristics of strip fin surfaces with X-arrangement of strips. ASME J. Heat Transfer 126 4 (2004) 697-707
    • (2004) ASME J. Heat Transfer , vol.126 , Issue.4 , pp. 697-707
    • Qu, Z.G.1    Tao, W.Q.2    He, Y.L.3
  • 27
    • 33751576389 scopus 로고    scopus 로고
    • Tsinghua University Press, Beijing, China
    • Liu W.Q. Design of Experiments (2005), Tsinghua University Press, Beijing, China
    • (2005) Design of Experiments
    • Liu, W.Q.1
  • 28
    • 0033457941 scopus 로고    scopus 로고
    • Forced convection in microstructures for electronic equipment cooling
    • Kim S.J., and Kim D. Forced convection in microstructures for electronic equipment cooling. J. Heat Transfer 121 (1999) 639-645
    • (1999) J. Heat Transfer , vol.121 , pp. 639-645
    • Kim, S.J.1    Kim, D.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.