Numerical analysis of flow and thermal performance of liquid-cooling microchannel heat sinks with bifurcation

Numerical Heat Transfer; Part A: Applications

Volumn 64, Issue 11, 2013, Pages 902-919

  Xie, Gongnan ^a   Chen, Zhiyong ^a   Sunden, Bengt ^b   Zhang, Weihong ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b LUND UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BIFURCATION RATIO; FLOW AND HEAT TRANSFER; HEAT TRANSFER SURFACES; LAMINAR HEAT TRANSFER; MICRO CHANNEL HEAT SINKS; OVERALL THERMAL RESISTANCE; STRAIGHT MICROCHANNELS; THERMAL PERFORMANCE;

COOLING; HEAT RESISTANCE; HEAT SINKS; LAMINAR FLOW; LIQUIDS; REYNOLDS NUMBER;

BIFURCATION (MATHEMATICS);

EID: 84884485221     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/10407782.2013.807689     Document Type: Article

References (25)

1. R. Mahajan, C. Chia-pin, and G. Chrysler, Cooling a Microprocessor Chip, Proc. of the IEEE, vol. 94, pp. 1476-1486, 2006.
2. D. B. Tuckerman and R. F. W. Pease, High-Performance Heat Sinking for VLSI, Electron Device Letters, IEEE, vol. 2, pp. 126-129, 1981.
3. P. S. Lee, S. V. Garimella, and D. Liu, Investigation of Heat Transfer in Rectangular Microchannels, Int. J. Heat and Mass Transfer, vol. 48, pp. 1688-1704, 2005.
4. W. Qu and I. Mudawar, Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single-Phase Micro-Channel Heat Sink, Int. J. of Heat and Mass Transfer, vol. 45, pp. 2549-2565, 2002.
5. H. Y. Wu and P. Cheng, An Experimental Study of Convective Heat Transfer in Silicon Microchannels with Different Surface Conditions, Int. J. of Heat and Mass Transfer, vol. 46, pp. 2547-2556, 2003.
6. Y. Sui, C. J. Teo, P. S. Lee, Y. T. Chew, and C. Shu, Fluid Flow and Heat Transfer in Wavy Microchannels, Int. J. Heat and Mass Transfer, vol. 53, pp. 2760-2772, 2010.
7. J. C. Kurnia, A. P. Sasmito, and A. S. Mujumdar, Numerical Investigation of Laminar Heat Transfer Performance of Various Cooling Channel Designs, Appl. Therm. Eng., vol. 31, pp. 1293-1304, 2011.
8. G. N. Xie, J. Liu, W. H. Zhang, and B. Sunden, Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling, ASME J. Electronic Packaging, vol. 134, pp. 041010-1-041010-6, 2012.
9. G. N. Xie, J. Liu, Y. Q. Liu, B. Sunden, and W. H. Zhang, Comparative Study of Thermal Performance of Longitudinal and Transversal Wavy Microchannel Heat Sinks for Electronic Cooling, ASME J. Electronic Packaging, vol. 135(2), pp. 021008-1-021008-9, 2013.
10. H. Wee, Q. Zhang, P. M. Ligrani, and S. Narasimhan, Numerical Predictions of Heat Transfer and Flow Characteristics of Heat Sinks with Ribbed and Dimpled Surfaces in Laminar Flow, Numer. Heat Transfer A, vol. 53, pp. 1156-1175, 2008.
11. Y. T. Yang and H. S. Peng, Numerical Study of Thermal and Hydraulic Performance of Compound Heat Sink, Numer. Heat Transfer A, vol. 55, pp. 432-447, 2009.
12. F. Zhou and I. Catton, Numerical Evaluation of Flow and Heat Transfer in Plate-Pin Fin Heat Sinks with Various Pin Cross-Sections, Numer. Heat Transfer A, vol. 60, pp. 107-128, 2011.
13. K. Vafai and L. Zhu, Analysis of Two-Layered Micro-Channel Heat Sink Concept in Electronic Cooling, Int. J. Heat and Mass Transfer, vol. 42, pp. 2287-2297, 1999.
14. T. C. Hung, W. M. Yan, and W. P. Li, Analysis of Heat Transfer Characteristics of Double-Layered Microchannel Heat Sink, Int. J. Heat and Mass Transfer, vol. 55, pp. 3090-3099, 2012.
15. T. C. Hung and W. M. Yan, Enhancement of Thermal Performance in Double-Layered Microchannel Heat Sink with Nanofluids, Int. J. Heat and Mass Transfer, vol. 55, pp. 3225-3238, 2012.
16. G. N. Xie, Y. Q. Liu, B. Sunden, and W. H. Zhang, Computational Study and Optimization of Laminar Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling, ASME J. Thermal Sci. Eng. Applications, vol. 5, pp. 011004-1-011004-9, 2013.
17. G. N. Xie, Z. Y. Chen, B. Sunden, and W. H. Zhang, Numerical Prediction of the Flow and Thermal Performance of Water-Cooled Single-Layer, and Double-Layer Wavy Microchannel Heat Sinks, Numer. Heat Transfer A, vol. 63, pp. 201-225, 2013.
18. G. N. Xie, Z. Y. Chen, B. Sunden, and W. H. Zhang, Comparative Study of Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Microchannel Heat Sinks, Numer. Heat Transfer, Part A, vol. 64, pp. 30-55, 2013.
19. J. M. Khodadadi, T. M. Nguyen, and N. S. Vlachos, Laminar Forced Convective Heat Transfer ina Two-Dimensional 90- Bifurcation, Numer. Heat Transfer A, vol. 9, pp. 677-695, 1986.
20. Y. Nakamura, W. Jia, and M. Yasuhara, Incompressible Flow Through Multiple Passages, Numer. Heat Transfer A, vol. 16, pp. 451-465, 1989.
21. Y. T. Yang and T. Y. Tsai, Numerical Calculation of Turbulent Flow in a Planar Bifurcation with a Protruding Branching Duct, Numer. Heat Transfer A, vol. 34, pp. 61-74, 1998.
22. W. Wechsatol, A. Bejan, and S. Lorente, Tree-Shaped Flow Architectures: Strategies for Increasing Optimization Speed and Accuracy, Numer. Heat Transfer, Part A, vol. 48, pp. 731-744, 2005.
23. X. Q. Wang, A. S. Mujumdar, and C. Yap, Effect of Bifurcation Angle in Tree-Shaped Microchannel Networks, J. Appl. Physics, vol. 102, pp. 073530-1-073530-8, 2007.
24. J. R. Zhang, Y. Jaluria, T. T. Zhang, and L. Jia, Combined Experimental and Numerical Study for Multiple Microchannel Heat Transfer System, Proc. of the 14th International Heat Transfer Conference, August 8-13, Washington, USA, paper no. IHTC-22235, 2010.
25. J. R. Zhang, P. T. Lin, and Y. Jaluria, Designs of Multiple Microchannel Heat Transfer Systems, Proc. of the ASME 2011 Int. Mechanical Engineering Congress & Exposition, November 11-17, 2011, Denver, Colorado, USA, paper no. IMECE2011-62539, 2011.