Combined experimental and numerical study for multiple microchannel heat transfer system

2010 14th International Heat Transfer Conference, IHTC 14

Volumn 6, Issue , 2010, Pages 25-30

  Zhang, Jingru ^a   Jaluria, Yogesh ^a   Zhang, Tiantian ^b   Jia, Li ^b  

^a RUTGERS UNIVERSITY   (United States)

^b BEIJING JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC CHIP COOLING; EXPERIMENTAL ARRANGEMENT; EXPERIMENTAL DATA; EXPERIMENTAL SETUP; HEAT TRANSFER SYSTEMS; INITIAL CONDITIONS; INPUT PARAMETER; LIQUID FLOW; MICRO CHANNEL HEAT SINKS; NUMERICAL STUDIES; STEADY STATE; STEADY-STATE CONDITION; TEMPERATURE VARIATION; THERMAL PERFORMANCE; THERMAL SYSTEMS;

COMPUTER SIMULATION; ELECTRONIC COOLING; HEAT TRANSFER; NUMERICAL MODELS; TEMPERATURE DISTRIBUTION; THERMOCOUPLES;

MICROCHANNELS;

EID: 84860511969     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IHTC14-22235     Document Type: Conference Paper

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