Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink

Applied Thermal Engineering

Volumn 25, Issue 2-3, 2005, Pages 173-182

  Yu, Xiaoling ^a   Feng, Jianmei ^a   Feng, Quanke ^a   Wang, Qiuwang ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Electronic device cooling; Heat sink; Heat transfer; Thermal resistance

Indexed keywords

COOLING SYSTEMS; DESIGN FOR TESTABILITY; ENERGY DISSIPATION; GEOMETRY; HEAT RESISTANCE; HEAT TRANSFER; OPTIMIZATION; PARAMETER ESTIMATION; TEMPERATURE MEASUREMENT;

ELECTRONIC DEVICE COOLING; ELECTRONIC PRODUCTS; GEOMETRIC PARAMETERS; PLATE FIN HEAT SINKS (PFHS);

HEAT SINKS;

EID: 5644275469     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2004.06.016     Document Type: Article

References (9)

1. J.R. Culham, Y.S. Muzychka, Optimization of plate fin heat sinks using entropy generation minimization, IEEE Transactions on Components and Packaging Technologies 24 (2) (2001) 159-165.
2. M. Iyengar, A. Bar-Cohen, Least-energy optimization of forced convection plate-fin heat sinks, IEEE Transactions on Components and Packaging Technologies 26 (1) (2003) 62-70.
3. Andrea de Lieto Vollaro, S. Grignaffini, F. Gugliermetti, Optimum design of vertical rectangular fin arrays, International Journal of Thermal Science 38 (1999) 525-529.
4. X.L. Yu, Q.K. Feng, Q.P. Liu, Research on the heat transfer and flow performance of a composite heat sink, Journal of Xi'an Jiaotong University 37 (7) (2003) 670-673 (in Chinese).
5. W.Q. Tao, Numerical Heat Transfer, second ed., Publishing Company of Xi'an Jiaotong University, Xi'an, 2001 (in Chinese).
6. H. Jonsson, B. Moshfegh, Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow by pass, IEEE Transactions on Components and Packaging Technologies 24 (2) (2001) 142-149.
7. K.A. Moores, Y.K. Joshi, Numerical and experimental characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins, in: The Seventh Intersociety Conference on Thermal and Thermo-mechanical Phenomena in Electronic Systems, Las Vegas, Nevada, vol. 2, 2000, pp. 385-390.
8. E.M. Sparrow, J.W. Ramsey, C.A.C. Altemani, Experiments on in-line pin fin arrays and performance comparisons with staggered arrays, Journal of Heat Transfer, Transactions of the ASME 102 (1980) 44-50.
9. M. Saini, R.L. Webb, Heat rejection limits of air cooled plane fin heat sinks for computer cooling, Part A: IEEE Transactions on Packaging Technologies 26 (1) (2003) 71-79.