Performance of online and offset micro pin-fin heat sinks with variable fin density

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 1, 2013, Pages 86-93

  Rubio Jimenez, Carlos A ^a,b   Kandlikar, Satish G ^b   Hernandez Guerrero, Abel ^a  

^a UNIVERSITY OF GUANAJUATO   (Mexico)

^b Rochester Institute of Technology   (United States)

Author keywords

Micro pin fin heat sink; online and offset fin configurations; uniform junction temperature; variable fin density

Indexed keywords

BOTTOM WALL; COOLING DEVICES; FIN CONFIGURATION; FIN DENSITY; FLAT FINS; FLOW LENGTH; IC CHIPS; INTEGRATED CIRCUIT CHIPS; JUNCTION TEMPERATURES; LAMINAR REGIME; OVERALL THERMAL RESISTANCE; PIN FIN HEAT SINKS; PUMPING POWER; SINGLE PHASE; TECHNICAL LITERATURE;

FINS (HEAT EXCHANGE); HEAT RESISTANCE; THERMOELECTRIC EQUIPMENT;

COOLING SYSTEMS;

EID: 84872346425     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2225143     Document Type: Article

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