Analysis of flow and thermal performance of a water-cooled transversal wavy microchannel heat sink for chip cooling

Journal of Electronic Packaging

Volumn 134, Issue 4, 2012, Pages

  Xie, Gongnan ^a   Liu, Jian ^a   Zhang, Weihong ^a   Sunden, Bengt ^b  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b LUND UNIVERSITY   (Sweden)

Author keywords

numerical simulation; overall thermal resistance; pressure drop; transversal wavy microchannel

Indexed keywords

DROPS; ELECTRONIC COOLING; HEAT FLUX; HEAT SINKS; LAMINAR FLOW; PRESSURE DROP; REYNOLDS NUMBER; THERMAL MANAGEMENT (ELECTRONICS);

CHIP COOLING; FLOW PERFORMANCE; INTEGRATED CIRCUIT CHIPS; MICRO CHANNEL HEAT SINKS; OUTPUT POWER; OVERALL THERMAL RESISTANCE; RECTANGULAR CROSS-SECTIONS; STRAIGHT MICROCHANNELS; THERMAL PERFORMANCE; TRANSVERSAL WAVY MICROCHANNEL;

MICROCHANNELS;

EID: 84872035698     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4023035     Document Type: Article

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