Challenges in Electronic Cooling - Opportunities for Enhanced Thermal Management Techniques - Microprocessor Liquid Cooled Minichannel Heat Sink

Heat Transfer Engineering

Volumn 25, Issue 3, 2004, Pages 3-12

  Schmidt, Roger ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COOLING; HEAT FLUX; HEAT LOSSES; LOW TEMPERATURE EFFECTS; MICROPROCESSOR CHIPS; MOSFET DEVICES;

MINICHANNELS; THERMAL MANAGEMENT;

HEAT SINKS;

EID: 16544377463     PISSN: 01457632     EISSN: None     Source Type: Journal    
DOI: 10.1080/01457630490279986     Document Type: Conference Paper

References (23)

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