Comparative study of thermal performance of longitudinal and transversal-wavy microchannel heat sinks for electronic cooling

Journal of Electronic Packaging

Volumn 135, Issue 2, 2013, Pages

  Xie, Gongnan ^a   Liu, Jian ^a   Liu, Yanquan ^b   Sunden, Bengt ^c   Zhang, Weihong ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c LUND UNIVERSITY   (Sweden)

Author keywords

Laminar heat transfer; Liquid cooling; Simulation; Wavy microchannel

Indexed keywords

DROPS; ELECTRONIC COOLING; HEAT RESISTANCE; HEAT SINKS; LAMINAR FLOW; PRESSURE DROP; REYNOLDS NUMBER; THERMAL LOAD; THERMAL MANAGEMENT (ELECTRONICS);

COMPARATIVES STUDIES; LAMINAR HEAT TRANSFER; LIQUID COOLING; MICRO CHANNEL HEAT SINKS; OVERALL THERMAL RESISTANCE; RECTANGULAR CROSS-SECTIONS; REYNOLD NUMBER; SIMULATION; THERMAL PERFORMANCE; WAVY MICROCHANNEL;

MICROCHANNELS;

EID: 84878573167     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4023530     Document Type: Article

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