Evaluation of single phase flow in microchannels for high heat flux chip cooling-thermohydraulic performance enhancement and fabrication technology

Heat Transfer Engineering

Volumn 25, Issue 8, 2004, Pages 5-16

  Kandlikar, Satish G ^a   Grande, William J ^a  

^a Kate Gleason College of Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX CHIPS; MICROCHANNEL COOLING; SINGLE-PHASE COOLING;

BIPOLAR TRANSISTORS; FLOW OF FLUIDS; HYDRAULICS; MICROELECTRONICS; PRESSURE DROP; REYNOLDS NUMBER;

HEAT FLUX;

EID: 10444249568     PISSN: 01457632     EISSN: None     Source Type: Journal    
DOI: 10.1080/01457630490519772     Document Type: Review

References (21)

1. Schmidt, R., Challenges in Electronic Cooling: Opportunities for Enhanced Thermal Management Techniques-Microprocessor Liquid Cooled Minichannel Heat Sink, First International Conference on Microchannels and Minichannels, Rochester, NY, April 24-25, pp. 951-959, 2003.
2. Tuckerman, D. B., and Pease, R. F., High Performance Heat Sinking for VLSI, IEEE Electron. Dev. Lett., EDL-2, pp. 126-129, 1981.
3. Nguyen, N.-T., and Wereley, S. T., Fundamentals and Applications of Microfluidics, Artech House, Boston, MA, 2002.
4. Kandlikar, S. G., and Grande, W. J., Evolution of Microchannel Flow Passages - Thermohydraulic Performance and Fabrication Technology, Heat Transfer Eng., vol. 24, pp. 3-17, 2003.
5. Liu, R. H., Stremler, M. A., Sharp, K. V., Olsen, M. G., Santiago, J. G., Adrian, R. J., Aref, H., and Beebe, D. J., Passive Mixing in a Three-Dimensional Serpentine Microchannel, J. Microelectromech. Syst., vol. 9, pp. 190-197, 2000.
6. Stroock, A. D., Dertinger, S. K., Whitesides, G. M., and Ajdari, A., Patterning Flows Using Grooved Surfaces, Anal. Chem., vol. 74, pp. 5306-5312, 2002.
7. Stroock, A. D., and Whitesides, G. M., Controlling Flows in Microchannels with Patterned Surface Charge and Topology, Acc. Chem. Res., vol. 36, pp. 597-604, 2003.
8. Incropera, F. P., Liquid Cooling of Electronic Devices by Single-Phase Convection, John Wiley and Sons, Inc., New York, 1999.
9. Nakayama, W., Enhanced Heat Transfer in Tight Space -A Frontier for Thermal Management of Microelectronic Equipment, Enhanced Heat Transfer, vol. 6, pp. 121-133, 1999.
10. Missaggia, L. J., Walpole, J. N., Liau, Z. L., and Phillips, R. J., Microchannel Heat Sinks for Two-Dimensional High-Power Density Diode Laser Arrays, IEEE J. Quantum Elect., vol. 25, pp. 1988-1989, 1989.
11. Bower, C., Ortega, A., Skandakumaran, P., Vaidyanathan, R., Green, C., and Phillips, T., Heat Transfer in Water-Cooled Silicon Carbide Multichannel Heat Sinks for High Power Electronic Application, Proc. IMECE '03, 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, DC, Nov. 16-21, 2003.
12. Kakac, S., Shah, R. K., and Aung, W., Handbook of Single-phase Convective Heat Transfer, John Wiley and Sons, New York, 1987.
13. Upadhye, H. R., and Kandlikar, S. G., Optimization of Microchannel Geometry for Direct Chip Cooling, Second International Conference on Microchannels and Minichannels, Rochester, NY, June 17-19, pp. 679-685, 2004.
14. Tao, W. Q., He, Y. L., Wang, Q. W., Qu, Z. G., and Song, F. Q., A Unified Analysis on Enhancing Single Phase Convective Heat Transfer with Field Synergy Principle, Int. J. Heat Mass Tran., vol. 45, pp. 4871-4879, 2002.
15. Bergles, A. E., ExHFT for Fourth Generation Heat Transfer Technology, Exp. Therm. Fluid Sci., vol. 26, pp. 335-344, 2002.
16. Steinke, M. E., and Kandlikar, S. G., Single-phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows, Second International Conference on Microchannels and Minichannels, Rochester, NY, June 17-19, pp. 141-148, 2004.
17. Lärmer, F., and Schilp, P., Method of Anisotropically Etching Silicon, German Patent No. DE 4,241,045, 1994.
18. Grande, W. J., Braddock, W. D., Shealy, J. R., and Tang, C. L., One-step Two-level Etching Technique for Monolithic Integrated Optics, Appl. Phys. Lett., vol. 51, pp. 2189-2191, 1987.
19. Grande, W. J., Fabrication Technologies for Advanced Heat Transfer Applications, First International Conference on Microchannels and Minichannels, Rochester, NY, April 24-25, pp. 215-222, 2003.
20. Sze, S. M., Semiconductor Devices, Physics and Technology, 2nd ed., John Wiley and Sons, Inc., Hoboken, NJ, 2002.
21. Kandlikar, S. G., Microchannels and Minichannels - History, Terminology, Classification, and Current Research Needs, First International Conference on Microchannels and Minichannels, Rochester, NY, April 24-25, pp. 1-6, 2003.