Modelingand optimization of micro-channel heat sinks for the cooling of 3D stacked integrated circuits

ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011

Volumn 6, Issue PARTS A AND B, 2011, Pages 999-1011

  Narayan, Varun ^a   Yao, Shi Chune ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCEPTABLE LIMIT; CHIP DESIGN; COUPLED MODELS; GEOMETRICAL OPTIMIZATION; HEAT SINK TEMPERATURE; HIGH DENSITY; HIGH HEAT FLUX; JUNCTION TEMPERATURES; LIQUID COOLING; OPTIMAL DESIGN; THROUGH-SILICON-VIA;

EXHIBITIONS; MECHANICAL ENGINEERING; OPTIMIZATION; THREE DIMENSIONAL COMPUTER GRAPHICS;

THREE DIMENSIONAL;

EID: 84869158778     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Tuckerman, D.B., and Pease, R.F.W., 1981, High- Performance Heat Sinking for VLSI, IEEE Electron Device Letters, Vol. EDL-2, No 5, pp 126-129
2. Koo, J., Im, S., Jiang, L., and Goodson, K.E, Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures, ASME Journal of Heat Transfer, January 2005, Vol. 127/ 49
3. Yu, R., High Density 3D Integration, International Conference on Electronic Packaging Technology & High Density Packaging, July 28th-31st 2008, Pages: 1-10
4. Kim, Y.J, Joshi, Y.K., Fedorov, G.A., et al., Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux, ASME Journal of Heat Transfer, APRIL 2010, Vol. 132
5. Liu, D. and Garimella., S., Analysis and optimization of the thermal performance of microchannel heat sinks, International Journal for Numerical Methods in Heat & Fluid Flow, Vol. 15 No. 1, 2005 pp. 7-26
6. Upadhye, H. and Kandlikar, S. G., Optimization of Microchannel Geometry for Direct Chip Cooling using Single Phase Heat Transfer, Proceedings of the Second International Conference on Microchannels and Minichannels, June 17-19, ASME 2004
7. Sekar, D., King, C., Dang, B. et al., A 3D-IC Technology with Integrated Microchannel Cooling, Interconnect Technology Conference, 2008. IITC 2008. International, June 1-4 2008, Pages: 13 - 15
8. Lee, J. and Mudawar, I., Two-phase flow in high- heat-flux micro-channel heat sink for refrigeration cooling applications: part II-Heat transfer characteristics, Int. J. Heat Mass Transfer 48 (5) (2005) 941-955.
9. Incropera, F.P., and DeWitt, D.P., 2002, Fundamentals of Heat and Mass Transfer, John Wiley & Sons, New York.
10. Ryu, J.H., Choi, D.H. and Kim, S.J., 2002, Numerical Optimization of the thermal performance of a microchannel heat sink, Int. J. Heat and Mass Transfer, Vol.45, pp.2823-2827.