Laminar convective heat transfer in a microchannel with internal longitudinal fins

International Journal of Thermal Sciences

Volumn 48, Issue 10, 2009, Pages 1908-1913

  Foong, Andrew J L ^a   Ramesh, N ^a   Chandratilleke, Tilak T ^a  

^a CURTIN UNIVERSITY   (Australia)

Author keywords

Electronics cooling; Internal fins; Microchannel; Passive augmentation

Indexed keywords

CHANNEL LENGTH; CONSTANT HEAT FLUX; CONVECTIVE HEAT TRANSFER; ELECTRONICS COOLING; ENHANCEMENT TECHNIQUES; EXTERNAL WALLS; FIN HEIGHT; FLOW PARAMETERS; FLUID FLOW; INTERNAL FINS; LOCAL NUSSELT NUMBER; LONGITUDINAL FIN; NUMERICAL STUDIES; PASSIVE AUGMENTATION; THREE-DIMENSIONAL NUMERICAL SIMULATIONS;

COOLING; FORCED CONVECTION; HEAT EXCHANGERS; LAMINAR FLOW; MICROCHANNELS; NUSSELT NUMBER;

FINS (HEAT EXCHANGE);

EID: 67849099268     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2009.02.015     Document Type: Article

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