A review of cooling in microchannels

Heat Transfer Engineering

Volumn 32, Issue 7-8, 2011, Pages 527-541

  Tullius, Jami F ^a   Vajtai, Robert ^a   Bayazitoglu, Yildiz ^a  

^a RICE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING MECHANISM; COOLING PERFORMANCE; DEVICE SIZES; ELECTRONIC COMPONENT; ELECTRONIC DEVICE; ELECTRONIC PERFORMANCE; FIN MATERIALS; HEAT TRANSFER SURFACES; HOT SPOT; LATTICE BOLTZMANN; LIQUID COOLANT; NANO SCALE; PIN-FINS; POWER DENSITIES; SURFACE AREA; TEMPERATURE VALUES; THERMAL AND MECHANICAL PROPERTIES;

CARBON NANOTUBES; COMPUTATIONAL CHEMISTRY; COMPUTATIONAL FLUID DYNAMICS; COOLING; DROP FORMATION; DYNAMICS; FINS (HEAT EXCHANGE); FORCED CONVECTION; MECHANICAL PROPERTIES; MICROCHANNELS; MOLECULAR DYNAMICS; NUMERICAL METHODS;

ELECTRONIC COOLING;

EID: 79952591991     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457632.2010.506390     Document Type: Conference Paper

References (102)

1. Pasupuleti, T., and Kandlikar, S. G., Cooling ofMicroelectronic Devices Packaged in a Single Chip Module using Single Phase Refrigerant R-123, Proceedings of ASME ICNMM2009-82262, Pohang, South Korea, 2009.
2. Zhong, X., Fan,Y., Liu, J., Zhang,Y.,Wang, T., and Cheng, Z., A Study of CFD Simulation for On-Chip CoolingWith 2D CNTMicro-Fin Array, Proceedings of HDP, Shanghai, China, 2007.
3. Zhong, X., Wang, T., Liu, J., Zhang, Y., and Cheng, Z., Computational Fluid Dynamics Simulation for On-Chip Cooling with Carbon Nanotube Micro-Fin Architectures, Proceedings of EMAP, Kowloon, China, 2006.
4. Mo, J. A., and Liu, J., Integrating Nano Carbontubes with Microchannel Cooler, Proceedings of HDP, Shanghai, China, 2004.
5. Kordas, K., Toth, G., Moilanen, P., Kumpumaki, M., Vahakangas, J., Uusimaki, A., Vajtai, R., and Ajayan, P. M., Chip Cooling with Integrated Carbon Nanotube Microfin Architectures, Applied Physics Letters, vol. 90, p. 3, 2007.
6. Narayanaswamy, R., Chandratilleke, T. T., and Foong, A. J. L., Laminar Convective Heat Transfer in a Microchannel with Internal Fins, Proceedings of ASME ICNMM2008-62044, Darmstadt, Germany, 2008.
7. Dix, J., Jokar, A., and Martinsen, R., A Microchannel Heat Exchanger for Electronics Cooling Applications, Proceedings of ASME ICNMM2008-62351, Darmstadt, Germany, 2008.
8. Lee, P. S., and Teo, C. J., Heat Transfer Enhancement in Microchannels Incorporating Slanted Grooves, Proceedings of ASME MNHT2008-52374, Tainan, Taiwan, 2008.
9. Baghernezhad, N., and Abouali, O., Numerical Investigation of Single Phase Heat Transfer Enhancement in a MicrochannelWith Grooved Surfaces, Proceedings of ASME ICNMM2008-62262, Darmstadt, Germany, 2008.
10. Peter, H., de Bock, J., Varanasi, K., Chamarthy, P., Deng, T., Kulkarni, A., Rush, B. M., Russ, B. A., Weaver, S. E., and Gerner, F. M., Experimental Investigation of Micro/Nano Heat Pipe Wick Structures, Proceedings of ASME IMECE2008-67288, Boston, Massachusetts, USA, 2008.
11. Incropera, F. P., Liquid Cooling of Electronic Devices by Single Phase Convection, Wiley-Interscience, New York, 1999.
12. Yu, C. K., Lu, D. C., and Cheng, T. C., Pool Boiling Heat Transfer on Artificial Micro-Cavity Surfaces in Dielectric Fluid FC-72, Journal of Micromechanics and Microengineering, vol. 15, pp. 2092-2099, 2006. (Pubitemid 44403659)
13. Jones, B. J., McHale, J. P., and Garimella, S. V., The Influence of Surface Roughness on Nucleate Pool Boiling Heat Transfer, Journal of Heat Transfer, vol. 131, p. 15, 2009.
14. Murshed, S. M. S.,Milanova,D., andKumar, R.,An Experimental Study of Surface Tension-Dependent Pool Boiling Characteristics of Carbon Nanotubes-Nanofluid, Proceedings of ASME ICNMM2009-82204, Pohang, South Korea, 2009.
15. Chen, C., and Ding, C., Heat Transfer Characteristic and Cooling Performance of Microchannel Heat Sinks With Nanofluids, Proceedings of ASME ICNMM2009-82079, Pohang, South Korea, 2009.
16. Yu, W., Xie, H., Li, Y., and Chen, L., The Thermal Transport Properties of Ethylene Glycol Based MGO Fluids, Proceedings of ASME ICNMM2009-82032, Pohang, South Korea, 2009.
17. Wong, K. V., and Castillo, M. J., Nanofluids: Analysis of Heat Transfer Mechanisms and Clustering, Proceedings of ASME IMECE2008-67326, Boston, 2008.
18. Das, S. K.,Choi, S.U.,Yu,W., and Pradeep, T., Nanofluids: Science and Technology,Wiley Interscience, Hoboken, NJ, 2007.
19. Buongiorno, J., Venerus, D. C., Prabhat, N., McKrell, T., Townsend, J., Christianson, R., Tolmachev, Y. V., Keblinski, P., Hu, L., Alvarado, J. L., Bang, I. C., Bishnoi, S. W., Bonetti, M., Botz, F., Cecere, A., Chang, Y., Chen, G., Chen, H., Chung, S. J., Chyu, M. K., Das, S. K., Paola, R. D., Ding, Y., Dubois, F., Dzido, G., Eapen, J., Escher, W., Funfschilling, D., Galand, Q., Gao, J., Gharagozloo, P. E., Goodson, K. E., Gutierrez, J. G., Hong, H., Horton, M., Hwang, K. S., Iorio, C. S., Jang, S. P., Jarzebski, A. B., Jiang, Y., Jin, L., Kabelac, S., Kamath, A., Kedzierski, M. A., Kieng, L. G., Kim, C., Kim, J., Kim, S., Lee, S. H., Leong, K. C., Manna, I., Michel, B., Ni, R., Patel, H. E., Philip, J., Poulikakos, D., Reynaud, C., Savino, R., Singh, P. K., Song, P., Sundararajan, T., Timofeeva, E., Tritcak, T., Turanov, A. N., Van Vaerenbergh, S.,Wen, D.,Witharana, S., Yang, C., Yeh, W., Zhao, X., and Zhou, S., A Benchmark Study on the Thermal Conductivity of Nanofluids, Journal of Applied Physics, vol. 106, p. 14, 2009.
20. Sadeghi, A., Asgarshamsi, A., and Saidi, M. H., Laminar Forced Convection in Annular Microchannels with Slip Flow Regime, Proceedings of ASME ICNMM2009-82013, Pohang, South Korea, 2009.
21. Nonino, C., Savino, S., and Del Giudice, S., Temperature- Dependent Viscosity and Viscous Dissipation Effects in Microchannel Flows With Uniform Wall Heat Flux, Heat Transfer Engineering, vol. 31, no. 8, pp. 682-691, 2010.
22. Shokouhmand, H., Aghvami, M., and Afshin, M. J., Pressure Drop and Heat Transfer of Fully Developed, Laminar Flow in Rough, Rectangular Microchannels, 0049Proceedings of ASME ICNMM2008-62042, Darmstadt, Germany, 2008.
23. Solovitz, S. A., Computational Study of Grooved Microchannel Enhancements, Proceedings of ASME ICNMM2008-62128, Darmstadt, Germany, 2008.
24. Vanapalli, S., ter Brake, H. J. M., Jansen, H. V., Burger, J. F., Holland, H. J., Veenstra, T. T., and Elwenspoek, M. C., Pressure Drop of Laminar Gas Flows in a Microchannel Containing Various Pillar Matrices, Journal of Micromechanics and Microengineering, vol. 17, pp. 1381-1386, 2007. (Pubitemid 47192959)
25. Lee, Y., Lee, P., and Chou, S., Enhanced Microchannel Heat Sinks Using Oblique Fins, Proceedings of ASME IPACK2009-89059, San Francisco, CA, 2009.
26. Bar-Cohen, A., Arik, M., and Ohadi, M., Direct Liquid Cooling of High Flux Micro and Nano Electronic Components, Proceedings of IEEE, vol. 94, no. 8, pp. 1549-1570, 2006. (Pubitemid 46432335)
27. Wei, J. J., Guo, L. J., and Honda, H., Experimental Study of Boiling Phenomena and Heat Transfer Performances of FC-72 Over Micro-Pin-Finned Silicon Chips, Heat and Mass Transfer, vol. 41, no. 8, pp. 744-755, 2005. (Pubitemid 40872167)
28. Honda, H., and Wei, J. J., Enhanced Boiling Heat Transfer From Electronic Components by Use of Surface Microstructures, Experimental Thermal and Fluid Science, vol. 28, pp. 159-169, 2004. (Pubitemid 38033977)
29. Mudawar, I., Assessment of High-Heat-Flux Thermal Management Schemes, IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 2, pp. 122-141, 2001. (Pubitemid 32609745)
30. Truong, B., Hu, L., and Buongiorno, J., Surface Modifications Using Nanofluids for Nucleate Boiling Heat Transfer and CHF Enhancements, Proceedings of ASME ICNMM2008-62085, Darmstadt, Germany, 2008.
31. Honda, H., and Wei, J. J., Advances in Enhanced Boiling Heat Transfer From Electronic Components, JSME International Journal, Series B, vol. 46, no. 4, pp. 479-490, 2003. (Pubitemid 38086635)
32. Shokouhmand, H., Ghazvini, M., and Shabanian, J., Analysis of Microchannel Heat Sink Performance Using Nanofluids in Turbulent and Laminar Flow Regimes and Its Simulation Using Artificial Neural Network, Proceedings of the Tenth International Conference on Computer Modeling and Simulation, Cambridge, UK, 2008.
33. Kim, S. J., McKrell, T., Buongiorno, J., and Hu, L., Experimental Study of Flow Critical Heat Flux in Low ConcentrationWater- Based Nanofluids, Proceedings of ASME MNHT2008-52321, Tainan, Taiwan, 2008.
34. Golubovic, M., Hettiarachchi, H. D. M., and Worek, W. M., Nano Fluids and Critical Heat Flux, Proceedings of ASME MNHT2008-52360, Tainan, Taiwan, 2008.
35. Buongiorno, J., Hu, L., and Bang, I. C., Towards an Explanation of the Mechanism of Boiling Critical Heat Flux Enhancement in Nanofluids, Proceedings of ASME ICNMM2007-30156, Puebla, Mexico, 2007.
36. Xie, H., Chen, L., Li, Y., and Yu, W., Thermal Transport Properties of Nanofluids Containing Carbon Nanotubes, Proceedings of ASME ICNMM2008-62210, Darmstadt, Germany, 2008.
37. Kabelac, S., and Anoop, K. B., Experimental Convective Heat TransferWith Nanofluids, Proceedings of ASME ICNMM2008-62099, Darmstadt, Germany, 2008.
38. Eastman, L. J. A., Choi, S. U. S., Li, S., Yu, W., and Thompson, L. J., Anomalously Increased Effective Thermal Conductivities of Ethylene Glycol-Based Nanofluids Containing Copper Nanoparticles, Applied Physics Letters, vol. 78, no. 6, pp. 718-720, 2001. (Pubitemid 33630327)
39. Kedzierski, M. A., Effect of CuO Nanoparticle Concentration on R134A/Lubricant Pool Boiling Heat Transfer, Proceedings of ASME MNHT2008-52116, Tainan, Taiwan, 2008.
40. Wright, B., Thomas, D., Hong, H., Groven, L., Puszynski, J., Duke, E., Ye, X., Jin, S., Smith, P., and Roy, W., Magnetic Field Enhanced Thermal Conductivity in Heat Transfer Nanofluids Containing Ni-Coated Single Wall Carbon Nanotubes, Proceedings of ASME IMECE2008-67936, Boston, 2008.
41. Kurowska, K. C., Dzido, G., Gierczycki, A., and Jarzebski, A. B., Experimental Investigation of Heat Transfer to Nanofluids, Proceedings of ASME ICNMM2008-62215, Darmstadt, Germany, 2008.
42. Liu, D. W., and Yang, C. Y., Effect of Nano-Particles on Pool Boiling Heat Transfer of Refrigerant 141b, Proceedings of ASME ICNMM2007-30221, Puebla, Mexico, 2007.
43. Celata, C. P., MicroscaleHeat Transfer in Single- and Two- Phase Flows: Scaling, Stability, Transition, Turbulence, Heat and Mass Transfer, vol. 6, pp. 16, 2009.
44. Thome, J. R., Dupont, V., and Jacobi, A.M., Heat Transfer Model for Evaporation in Microchannels. Part I: Presentation of the Model, International Journal of Heat and Mass Transfer, vol. 47, pp. 3375-3385, 2004. (Pubitemid 38616311)
45. Jacobi, A. M., and Thome, J. R., Heat Transfer Model for Evaporation of Elongated Bubble Flows in Microchannels, Journal of Heat Transfer, vol. 124, no. 6, pp. 1131-1136, 2002. (Pubitemid 36144959)
46. Takeuchi, G., Fujiwara, A., Abe, Y., and Suzuki, U., Study of Condensation Behavior in Two-Phase Flow Through a Microchannel, Proceedings of ASME MNHT2008-52201, Tainan, Taiwan, 2008.
47. Cheng, L., Ribatski, G., and Thome, J. R., Two-Phase Flow Patterns and Flow-Pattern Maps: Fundamentals and Applications, Applied Mechanics Review, vol. 61, no. 5, 2008.
48. Chien, L., Pei, S. Y., and Wu, T. Y., Convective Heat Transfer Performance of Water and FC-72 in a One Side Heat Rectangular Channel Having Pin-Fins, Proceedings of ASME MNHT2008-52225, Tainan, Taiwan, 2008.
49. Chien, L., Pei, S. Y., and Wu, T. Y., Convective Heat Transfer Performance of FC-72 in a Pin-Finned Channel, Proceedings of ASME ICNMM2008-62298, Darmstadt, Germany, 2008.
50. Lie, Y. M., Ke, J. H., Chang, W. R., Cheng, T. C., and Lin, T. F., Saturated Flow Boiling Heat Transfer and Associated Bubble Characteristics of FC-72 on a Heated Micro-Pin- Finned Silicon Chip, International Journal of Heat and Mass Transfer, vol. 50, pp. 3862-3876, 2007. (Pubitemid 46733970)
51. Cetegen, E., Dessiatoun, S., and Ohadi, M., Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces, Proceedings of ASME ICNMM2008-62285, Darmstadt, Germany, 2008.
52. Kandlikar, S. G., and Balasubramanian, P., An Experimental Study on the Effect of Gravitational Orientation on Flow Boiling of Water in 1054 × 197 μm Parallel Minichannels, Journal of Heat Transfer, vol. 127, pp. 820-829, 2005. (Pubitemid 41236118)
53. Luciani, S., Brutin, D., Le Niliot, C., and Tadrist, L., Two-Phase Flow Experimental Study: Influence of Gravity Level on Local Boiling Heat Transfer Inside a Microchannel, Proceedings of ASME ICNMM2009-82192, Pohang, South Korea, 2009.
54. Peng, H., Ding, G., Jiang, W., Hu, H., and Gao, Y., Heat Transfer Characteristics of Refrigerant-Based Nanofluid Flow Boiling Inside a Horizontal Smooth Tube, International Journal of Refrigeration, vol. 32, pp. 1259-1270, 2009.
55. Che, J., Cagin, T., and Goddard, W. A. III. Thermal Conductivity of Carbon Nanotubes, Nanotechnology, vol. 11, pp. 65-69, 2000.
56. Morris, J. E., Nanopackaging: Nanotechnologies and Electronics Packaging, Springer, Portland, 2008.
57. Ekstrand, L., Mo, Z., Zhang, Y., and Liu, J., Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling, Proceedings of Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 2005.
58. Harris, P. J. F., Hernandez, E., and Yakobson, B. I., Carbon Nanotubes and Related Structures: New Materials for the Twenty-First Century, American Journal of Physics, vol. 72, no. 3, p. 415, 2004.
59. Kuo, C. H., and Huang, H. M., Measurements on the Thermal Conductivity of Epoxy/Carbon-Nanotube Composite, Proceedings of ASME MNHT2008-52189, Tainan, Taiwan, 2008.
60. Harris, P. J. F., Carbon Nanotube Science: Synthesis, Properties and Applications, Cambridge University Press, Cambridge, 2009.
61. Treacy, M. M. J., Ebbesen, T.W., and Gibson, J. M., Exceptionally High Young's Modulus Observed for Individual Carbon Nanotubes, Nature, vol. 381, pp. 678-680, 1996. (Pubitemid 126515869)
62. Jorio, A., Dresselhaus,M. S., and Dresselhaus, G., Carbon Nanotubes: Advanced Topics in the Synthesis, Structure, Properties and Applications, Springer, New Y, 2008.
63. Dresselhaus, M. S., Dresselhaus, G., and Avouris, P., Carbon Nanotubes: Synthesis, Structure, Properties, and Applications. Springer, New York, 2001.
64. Mo, Z., Morjan, R., Anderson, J., Campbell, E. E. B., and Liu, J., Integrated Nanotube Microcooler for Microelectronics Applications, Proceedings of Electronic Components and Technology Conference, La Buena Vista, FL, 2005.
65. Maruyama, S., A Molecular Dynamics Simulation of Heat Conduction of a Finite Length Single-Walled Carbon Nanotube, Microscale Thermophysical Engineering, vol. 7, no. 1, pp. 41-50, 2003.
66. Yao, Z., Wang, J. S., Li, B., and Liu, G. R., Thermal Conduction of Carbon Nanotubes using Molecular Dynamics, Physical Review B, vol. 71, no. 8, p. 15, 2004.
67. Shiomi, J., and Maruyama, S., Molecular Dynamics Simulations of Diffusive-Ballistic Heat Conduction in Carbon Nanotubes, Material Research Society, vol. 1022, p. 6, 2007.
68. Lukes, J. R., and Zhong, H., Thermal Conductivity of Individual Single-Wall Carbon Nanotubes, Journal of Heat Transfer, vol. 129, no. 6, pp. 705-716, 2007. (Pubitemid 47096476)
69. Ci, L., Manikoth, S. M., Li, X., Vajtai, R., and Ajayan, P. M., Ultrathick Freestanding Aligned Carbon Nanotube Films, Advanced Materials, vol. 19, pp. 3300-3303, 2007. (Pubitemid 350044472)
70. Andrews, R., Jacques,D., Rao, A. M.,Derbyshire, F., Qian, D., Fan, X., Dickey, E. C., and Chen, J., Continuous Production of Aligned Carbon Nanotubes: A Step Closer to Commercial Realization, Chemical Physics Letters, vol. 303, pp. 467-474, 1999. (Pubitemid 129593914)
71. Wei, B. Q., Vajtai, R., Jung, Y., Ward, J., Zhang, Y., Ramanath, G., and Ajayan, P. M., Organized Assembly of Carbon Nanotubes, Nature, vol. 416, pp. 495-496, 2002. (Pubitemid 34288841)
72. Zhang, Z., Wei, B., Ramanath, G., and Ajayan, P., Substrate-Site Selective Growth of Aligned Carbon Nanotubes, Applied Physics Letters, vol. 77, no. 23, pp. 3764-3766, 2000.
73. Wei, B. Q., Vajtai, R., Jung, Y., Ward, J., Zhang, R., Ramanath, G., and Ajayan, P. M., Assembly of Highly- Organized Carbon Nanotube Architectures by Chemical Vapor Deposition, Chemical Materials, vol. 15, no. 8, pp. 1598-1606, 2003.
74. Vajtai, R., Wei, B. Q., Jung, Y. J., Cao, A. Y., Biswas, S. K., Ramanath, G., and Ajayan, P. M., Building and Testing Organized Architectures of Carbon Nanotubes, IEEE Transactions on Nanotechnology, vol. 2, no. 4, p. 10, 2004.
75. Vajtai, R., Wei, B. Q., and Ajayan, P. M., Controlled Growth of Carbon Nanotubes, Philosophical Transactions of the Royal Society of London Series A-Mathematical and Physical Sciences, vol. 362, pp. 2143-2160, 2004. (Pubitemid 39436506)
76. Vajtai, R.,Wei, B., Zhang, Z., Jung, Y., Ramanath, G., and Ajayan, P., Building Carbon Nanotubes and Their Smart Architectures, Smart Materials and Structures, vol. 11, pp. 691-698, 2002. (Pubitemid 35298463)
77. Hung, W. H., Kumar, R., Bushmaker, A., Cronin, S. B., and Bronikowski, M. J., Rapid Prototyping of Three- Dimensional Microstructures From Multiwalled Carbon Nanotubes, Applied Physics Letters, vol. 91, p. 3, 2007.
78. Chakrapani, N., Wei, B. Q., Carillo, A., Ajayan, P. M., and Kane, R., Capillarity Driven Assembly of Two- Dimensional CellularCarbon Nanotube Foams,PNAS, vol. 101, no. 12, pp. 4009-4012, 2004.
79. Kaur, S., Sahoo, S., Ajayan, P. M., and Kane, R. S., Capillarity-Driven Assembly of Carbon Nanotubes on Substrates Into Dense Vertically Aligned Arrays, Advanced Materials, vol. 19, pp. 2984-2987, 2007. (Pubitemid 47597900)
80. Kharazmi, A., and Kamali, R., Molecular Dynamic Simulation of Surface Roughness Effects on Nanoscale Flows, Proceedings of ASME ICNMM2009-82187, Pohang, South Korea, 2009.
81. Darbandi, M., and Setayeshgar, A., Flow Past Confined Nano Cylinder in Microscale Channels, Proceedings of ASME ICNMM2009-82222, Pohang, South Korea, 2009.
82. Sadeghi, A., Asgarshamsi, A., and Saidi, M. H., Analysis of Laminar Flow in the Entrance Region of Parallel Plate Microchannels for Slip Flow, Proceedings of ASME ICNMM2009-82012, Pohang, South Korea, 2009.
83. Bayazitoglu, Y., Tunc, S. G., Wilson, K., and Tjahjon, I., Convective Heat Transfer for Single-Phase Gases in Microchannel Slip Flow, in Microscale Heat Transfer-Fundamental and Applications, Kluwer Academic, Dordrecht, the Netherlands, pp. 125-148, 2005.
84. Guzman, A. M., Diaz, A. J., Sanhueza, L. E., and Escobar, R. A., Flow Characteristics of Rarified Gases in Micro- Grooved Channels by the Lattice-Boltzmann Method, Proceedings of ASME MNHT2008-52051, Tainan, Taiwan, 2008.
85. Bayazitoglu, Y., and Kakac, S., Flow Regimes in Microchannel Single Phase Gaseous Fluid Flow, in Microscale Heat Transfer-Fundamental and Applications, Kluwer Academic, Dordrecht, the Netherlands, pp. 75-92, 2005.
86. Gokaltun, S., and Dulikravich, G. S., Lattice Boltzmann Method for Steady Gas Flows in Microchannels with Imposed Slip Wall Boundary Condition, Proceedings of ASME ICNMM2007-30060, Puebla, Mexico, 2007.
87. O'Hare, L., and Reese, J. M., Numerical Models of Gas Flow and Heat Transfer in Microscale Channels: Capturing Rarefaction Behavior Using a Constitutive Scaling Approach, Proceedings of ASME ICNMM2007-30097, Puebla, Mexico, 2007.
88. Harley, J., Huang, Y., Bau, H., and Zemel, J. N., Gas Flow in Microchannels, Journal of Fluid Mechanics, vol. 284, pp. 257-274, 1995.
89. Araki, T., Kim, M. S., Hiroshi, I., and Suzuki, K., An Experimental Investigation of Gaseous Flow Characteristics in Microchannels, Proceedings of International Conference on Heat Transfer and Transport Phenomena in Microscale, New York, 2000.
90. Arkilic, E. B., Breuer, K. S., and Schmidt, M. A., Gaseous Flow in Microchannels, Proceedings of ASME Application of Microfabrication to Fluid Mechanics, FED, New York, USA, vol. 197, pp. 57-66, 1994.
91. Arkilic, E. B., Breuer, K. S., and Schmidt, M. A., Gaseous Slip Flow in Long Microchannels, Journal of Microelectromechanical Systems, vol. 6, no. 2, pp. 167-178, 1997. (Pubitemid 127607048)
92. Zhang, Y. H., Gu, X. J., Barber, R.W., and Emerson, D. R.,Modelling Thermal Flow in the Transition Regime Using a Lattice Boltzmann Approach, EPL, vol. 77, p. 5, 2007.
93. Ansumali, S., Karlin, I. V., Arcidiacono, S., Abbas, A., and Prasianakis, N. I., Hydrodynamics Beyond Navier- Stokes: Exact Solution to the LatticeBoltzmann Hierarchy, Physical Review Letters, vol. 98, p. 4, 2007.
94. Chen, S., and Doolen, G. D., Lattice Boltzmann Method for Fluid Flows, Annual Review of Fluid Mechanics, vol. 30, pp. 329-364, 1998.
95. Wolf-Gladrow, D. A., Lattice-Gas Cellular Automata and Lattice Boltzmann Models-An Introduction, Springer, New York, 2005.
96. Kanti De, A., Numerical Modeling of Microscale Mixing Using Lattice Boltzmann Method, Dissertation, Virginia Polytechnic Institute and StateUniversity, Blacksburg, 2008.
97. Shirani, E., and Jafari, S., Application of LBM in Simulation of Flow in Simple Micro-Geometries and Micro Porous Media, African Physical Review, vol. 1, pp. 34-42, 2007.
98. Shibahara, M., Inoue, K., and Kobayashi, K., A Molecular Dynamics Study on Effects ofNanostructural Clearances at an Interface on Thermal Resistance, Proceedings of ASME MNHT2008 -52276, Tainan, Taiwan, 2008.
99. Hu,M., Shenogin, S., Keblinski, P., and Raravikar, N., Air Flow through Carbon Nanotube Arrays, Applied Physics Letters, vol. 91, p. 3, 2007.
100. Kharazmi, A., and Kamali, R., Molecular Dynamic Simulation of Surface Roughness Effects on Nanoscale Flows, Proceedings of ASME ICNMM2009-82187, Pohang, South Korea, 2009.
101. Srivastava,R.R., Schneider,N.M., and Kandlikar, S., Numerical Simulation of Single Phase Liquid Flow in Narrow Rectangular Channels with Structured Roughness, Proceedings of ICNMM2009-82255, Pohang, South Korea, 2009.
102. Bayazitoglu, Y., and Tullius, J. F., Nanocarpets Decorating the Walls of Microchannels, Proceedings of ASME ICNMM2009-82125, Pohang, South Korea, 2009.