Prospects of thin-film thermoelectric devices for hot-spot cooling and on-chip energy harvesting

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 12, 2013, Pages 2059-2067

  Choday, Sri Harsha ^a   Lundstrom, Mark S ^a   Roy, Kaushik ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Device ZT; energy harvesting; hot spots; thermoelectric cooling; thin film superlattice rm Bi 2 rm Te 3

Indexed keywords

DEVICE ZT; FINITE ELEMENT SIMULATIONS; HOTSPOTS; PACKAGE LEVELS; THERMOELECTRIC COOLING; THERMOELECTRIC DEVICES; THERMOELECTRIC MATERIAL; THIN-FILM SUPERLATTICE {\RM BI}-{2}{\RM TE}3;

ENERGY HARVESTING; HEAT FLUX;

COOLING;

EID: 84890907378     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2273873     Document Type: Article

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