Design of bulk thermoelectric modules for integrated circuit thermal management

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 750-757

  Fukutani, Kazuhiko ^a   Shakouri, Ali ^a  

^a University of California   (United States)

Author keywords

Contact resistance; Equivalent circuit models; External thermal resistance; Integrated circuit (IC); Thermal management; Thermoelectric (TE) modules

Indexed keywords

CONTACT RESISTANCE; HEAT LOSSES; INTEGRATED CIRCUIT LAYOUT; TEMPERATURE CONTROL; THERMOELECTRICITY;

EQUIVALENT CIRCUIT MODELS; EXTERNAL THERMAL RESISTANCE; THERMOELECTRIC (TE) MODULES;

THERMOELECTRIC EQUIPMENT;

EID: 33947200692     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885938     Document Type: Article

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