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Volumn , Issue , 2007, Pages 610-615
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Novel low-temperature CoC interconnection technology for Multichip LSI (MCL)
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Author keywords
[No Author keywords available]
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Indexed keywords
DATA TRANSFER;
ELECTRIC RESISTANCE;
INTERMETALLICS;
CHIP ON CHIP (COC) INTERCONNECTION;
SYSTEM ON CHIP (SOC);
TEST ELEMENT GROUPS (TEG);
LSI CIRCUITS;
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EID: 35348885430
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2007.373859 Document Type: Conference Paper |
Times cited : (28)
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References (7)
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