Recent progress of half-Heusler for moderate temperature thermoelectric applications

Materials Today

Volumn 16, Issue 10, 2013, Pages 387-395

  Chen, Shuo ^a   Ren, Zhifeng ^a  

^a University of Houston   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE PERFORMANCE; ELECTRICAL CONDUCTIVITY; HIGH-TEMPERATURE ANNEALING; MODERATE TEMPERATURE; RESEARCH INTERESTS; THERMO-ELECTRIC MATERIALS; THERMOELECTRIC APPLICATION; THERMOELECTRIC PERFORMANCE;

HOT PRESSING; SEEBECK COEFFICIENT; THERMOELECTRICITY;

THERMAL CONDUCTIVITY;

EID: 84887973389     PISSN: 13697021     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mattod.2013.09.015     Document Type: Review

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