Effect of mechanical milling on thermoelectric properties of half-Heusler ZrNiSn0.98Sb0.02 intermetallic compound

Materials Science and Engineering: B

Volumn 166, Issue 1, 2010, Pages 99-103

  Katsuyama, Shigeru ^a   Kobayashi, Tetsuya ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Electrical resistivity; Figure of merit; Grain boundaries; Phonon dispersion; Seebeck coefficient; Thermal conductivity

Indexed keywords

ELECTRIC CONDUCTIVITY; INTERMETALLICS; MECHANICAL ALLOYING; MILLING (MACHINING); PHONONS; SEEBECK COEFFICIENT; TERNARY ALLOYS; THERMAL CONDUCTIVITY; THERMOELECTRIC EQUIPMENT; TIN ALLOYS; ZIRCONIUM ALLOYS;

% REDUCTIONS; ELECTRICAL RESISTIVITY; FIGURE OF MERIT; GRAIN-BOUNDARIES; HALF-HEUSLER; INTERMETALLICS COMPOUNDS; MECHANICAL MILLING; PARTIAL SUBSTITUTION; PHONON DISPERSIONS; THERMOELECTRIC PROPERTIES;

GRAIN BOUNDARIES;

EID: 70749092266     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2009.10.021     Document Type: Article

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