Thermal and electronic charge transport in bulk nanostructured Zr 0.25Hf0.75NiSn composites with full-Heusler inclusions

Journal of Solid State Chemistry

Volumn 184, Issue 11, 2011, Pages 2948-2960

  Makongo, Julien P A ^a   Misra, Dinesh K ^a   Salvador, James R ^b   Takas, Nathan J ^a   Wang, Guoyu ^c   Shabetai, Michael R ^a   Pant, Aditya ^a   Paudel, Pravin ^a   Uher, Ctirad ^c   Stokes, Kevin L ^a   Poudeu, Pierre F P ^a,c  

^a UNIVERSITY OF NEW ORLEANS   (United States)

^b GENERAL MOTORS CORPORATION   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Full Heusler; Half Heusler; Microstructure; Nanocomposite; Spinodal decomposition; Thermoelectric properties

Indexed keywords

ELECTRICAL CONDUCTIVITY; ELECTRONIC CHARGES; FULL-HEUSLER; HALF-HEUSLER; HIGH DENSITY; MATRIX; MOLE FRACTION; NANO-STRUCTURED; NI DIFFUSION; PERCOLATION THRESHOLDS; SINTERED SPECIMEN; SPARK PLASMA; SPINODALS; THERMOELECTRIC PROPERTIES; VACANT SITES;

CARRIER CONCENTRATION; ELECTRIC CONDUCTIVITY; HAFNIUM; MICROSTRUCTURE; NANOCOMPOSITES; SINTERING; SOLID STATE REACTIONS; SOLVENTS; SPINODAL DECOMPOSITION; THERMOELECTRIC EQUIPMENT; TRANSMISSION ELECTRON MICROSCOPY; ZIRCONIUM;

THERMAL CONDUCTIVITY;

EID: 80054940922     PISSN: 00224596     EISSN: 1095726X     Source Type: Journal    
DOI: 10.1016/j.jssc.2011.08.036     Document Type: Article

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