Vacancy site occupation by Co and Ir in half-Heusler ZrNiSn and conversion of the thermoelectric properties from n-type to p-type

Acta Materialia

Volumn 58, Issue 13, 2010, Pages 4354-4361

  Kimura, Yoshisato ^a   Tanoguchi, Toshiyasu ^a   Kita, Takuji ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b TOYOTA MOTOR CORPORATION   (Japan)

Author keywords

Crystal structure; Directional solidification; Intermetallic compounds; Thermal conductivity; Thermoelectric properties

Indexed keywords

COBALT COMPOUNDS; CRYSTAL STRUCTURE; INTERMETALLICS; IRIDIUM; NICKEL; SOLIDIFICATION; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMOELECTRIC EQUIPMENT;

HALF-HEUSLER; HALF-HEUSLER COMPOUND; HEUSLER COMPOUND; LATTICE THERMAL CONDUCTIVITY; P-TYPE; SOLUTION EFFECTS; THERMOELECTRIC PROPERTIES; VACANCY SITES;

THERMOELECTRICITY;

EID: 78650732120     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.04.028     Document Type: Article

References (24)

1. Aliev FG, Brandt NB, Moshchalkov VV, Kozyrkov VV, Skolozdra RV, Belogorokhov AI. Z Phys B Condens Mater 1989;75:167.
2. Uher C, Yang J, Hu S, Morelli DT, Meisner GP. Phys Rev B 1999;59:8615.
3. Hohl H, Ramirez A, Goldmann C, Ernst G. J Phys Condens Matter 1999;11:1697.
4. Tritt TM, Bhattacharya S, Xia Y, Ponnambalam V, Poon SJ, Thadhani N. Appl Phys Lett 2002;81:43.
5. Sakurada S, Shutoh N. Appl Phys Lett 2005;86:082105.
6. Culp SR, Poon SJ, Hickman N, Tritt TM, Blumm J. Appl Phys Lett 2006;88:042106.
7. Kimura Y, Kuji T, Zama A, Shibata Y, Mishima Y. MRS symposium proceedings, vol. 886. Pittsburgh (PA): Materials Research Society; 2006. p. 331.
8. Kimura Y, Tamura Y, Kita T. Appl Phys Lett 2008;92:012105.
9. Kimura Y, Ueno H, Mishima Y. J Electron Mater 2009;38:934.
10. Kimura Y, Ueno H, Kenjo T, Asami C, Mishima Y. MRS symposium proceedings, vol. 1128. Pittsburgh (PA): Materials Research Society; 2009. p. 15.
11. Kimura Y, Zama A. Appl Phys Lett 2006;89:172110.
12. Kimura Y, Zama A, Mishima Y. In: Proceedings of the 25th international conference on thermoelectrics, ICT, 2006. p. 115.
13. Katsuyama S, Matsushima H, Ito M. J Alloys Compd 2004;385:232.
14. Hohl H, Ramirez AP, Goldmann C, Ernst G, Woelfing B, Bucher E. J Phys Condens Matter 1998;10:7843.
15. Xia Y, Ponnambalam V, Bhattacharya S, Pope AL, Poon SJ, Tritt TM. J Phys Condens Matter 2001;13:77.
16. Sekimoto T, Kurosaki K, Muta H, Yamanaka S. J Alloys Compd 2006;407:326.
17. Kawano K, Kurosaki K, Sekimoto T, Muta H, Yamanaka S. Appl Phys Lett 2007;91:062115.
18. Culp SR, Simonson JW, Poon SJ, Ponnambalam V, Edwards J, Tritt TM. Appl Phys Lett 2008;93:022105.
19. Ponnambalam V, Alboni PN, Edwards J, Tritt TM, Culp SR, Poon SJ. J Appl Phys 2008;103:063716.
20. Wu T, Jiang W, Li X, Zhou Y, Chen L. J Appl Phys 2007;102: 103705.
21. Wu T, Jiang W, Li X, Bai S, Liufu S, Chen L. J Alloys Compd 2009;467:590.
22. Kawano K, Kurosaki K, Muta H, Yamanaka S. J Appl Phys 2008;104:013714.
23. Slack GA. Phys Rev 1957;105:829.
24. Abeles B. Phys Rev B 1963;29:1906.