Curing kinetics and properties of epoxy resin-fluorenyl diamine systems

Polymer

Volumn 49, Issue 20, 2008, Pages 4399-4405

  Liu, Wenbin ^a   Qiu, Qihao ^b   Wang, Jun ^a   Huo, Zichun ^a   Sun, He ^a  

^a HARBIN ENGINEERING UNIVERSITY   (China)

^b Ningbo Chemical Industry Zone   (China)

Author keywords

Curing kinetics; Fluorenyl diamine; Thermal properties

Indexed keywords

ACTIVATION ENERGY; AMINES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; ETHERS; GLASS TRANSITION; HEAT RESISTANCE; KINETICS; MOISTURE; PHENOLS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

ACTIVATION ENERGIES (EA); CURING KINETICS; CYCLOALIPHATIC EPOXY RESINS; D. DYNAMIC MECHANICAL THERMAL ANALYSES (DMTA); DIGLYCIDYL ETHER OF BISPHENOL; DIGLYCIDYL ETHER OF BISPHENOL-A; FLUORENYL; NON ISOTHERMAL DIFFERENTIAL SCANNING CALORIMETRY;

EPOXY RESINS;

ABSORPTION; CURING (CHEMISTRY); EPOXY RESIN; GLASS TRANSITION TEMPERATURE; HEAT RESISTANCE; MOISTURE; ORGANIC POLYMER; THERMAL STABILITY;

EID: 50949125980     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2008.08.004     Document Type: Article

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