Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 641-647

  Jiang, Tengfei ^a   Wu, Chenglin ^a   Su, Peng ^b   Liu, Xi ^b   Chia, Pierre ^b   Li, Li ^b   Son, Ho Young ^c   Oh, Jae Sung ^c   Byun, Kwang Yoo ^c   Kim, Nam Seog ^c   Im, Jay ^a   Huang, Rui ^a   Ho, Paul S ^a  

^a The University of Texas at Austin   (United States)

^b CISCO SYSTEMS   (United States)

^c Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT OBSERVATIONS; HIGH-RESOLUTION MAPPING; STRESS AND DEFORMATION; STRESS CHARACTERISTICS; SYNCHROTRON MEASUREMENTS; THERMOMECHANICAL MODEL; THROUGH SILICON VIAS; X RAY MICRODIFFRACTION;

PLASTICITY; STRESS CONCENTRATION; X RAY DIFFRACTION;

X RAYS;

EID: 84883337450     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575641     Document Type: Conference Paper

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