Centrifugal formulation of percolating thermal underfills for flip-chip applications

2012 7th International Conference on Integrated Power Electronics Systems, CIPS 2012

Volumn , Issue , 2012, Pages

  Zuercher, J ^a   Goicochea, J ^a   Matsumoto, K ^b   Michel, B ^a   Brunschwiler, T ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D PACKAGES; 3D STACKING APPLICATIONS; CENTRIFUGAL ACCELERATION; CENTRIFUGAL FORCES; CONDUCTIVE PARTICLE; FILLING FRACTIONS; FLIP CHIP APPLICATIONS; SHAPE AND SIZE;

CENTRIFUGATION; DIES; HEAT RESISTANCE;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84881107565     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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