Thermal behavior analysis of lead-free flip-chip ball grid array packages with different underfill material properties

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Chen, Hsin Yuan ^a   Hsu, Kuo Yuan ^a   Lin, Tsung Shu ^b   Leu, Jihperng ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; BRAZING; CHIP SCALE PACKAGES; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; FRACTURE FIXATION; GLASS TRANSITION; LEAD; METALLIC COMPOUNDS; PHOTOMASKS; SOLDERED JOINTS; SOLDERING ALLOYS; TECHNOLOGY; THERMAL EXPANSION; THERMAL SPRAYING; THERMAL STRESS; THREE DIMENSIONAL; THREE DIMENSIONAL COMPUTER GRAPHICS; WELDING;

3-D SIMULATIONS; 90NM NODE; BEHAVIOR ANALYSIS; BGA PACKAGES; CO-EFFICIENT OF THERMAL EXPANSION; ELECTRONIC PACKAGING; FEA MODELING; FLIP-CHIP BALL GRID ARRAY; FRACTURE SUSCEPTIBILITY; GLASS TRANSITION TEMPERATURE TG; HIGH RESOLUTION MOIRE; HIGH-DENSITY PACKAGING; INTERNATIONAL CONFERENCES; LEAD-FREE; LEAD-FREE SOLDERING; LOW CTE; LOW-K MATERIALS; MATE RIAL PROPERTIES; MICROELECTRONIC PRODUCTS; RC DELAYS; REFLOW TEMPERATURES; SIMULATION RESULTS; SN-PB EUTECTIC SOLDER; SOLDER ALLOYS; SOLDER BUMPING; STRESS INDUCED; UNDERFILL; UNDERFILL MATERIALS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 52449130617     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607150     Document Type: Conference Paper

References (14)

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