High thermal conductive underfill materials for flip-chip application

PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photon

Volumn , Issue , 2008, Pages

  Liang, Qizhen ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP APPLICATIONS; HEXAGONAL BORON NITRIDE (H-BN); HIGH THERMAL; LOW LEVEL; MECHNICAL PROPERTIES; THERMAL TRANSFER; THERMALLY CONDUCTIVE FILLERS; UNDERFILL MATERIALS; UNDERFILLS;

ADHESIVES; BORON; BORON NITRIDE; CONDUCTIVE MATERIALS; EPOXY RESINS; FLIP CHIP DEVICES; MICROELECTRONICS; MORPHOLOGY; NITRIDES; POLYMERS; RESINS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

FILLERS;

EID: 77950889784     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PORTABLE-POLYTRONIC.2008.4681290     Document Type: Conference Paper

References (6)

1. Schmidt, R., "Challenges in Electronic Cooling-Opportunities for Enhanced Thermal Management Techniques - Microprocessor Liquid Cooled Minichannel Heat Sink," Heat Transfer Engineering, 25(3), 3-12 (2004)
2. CP Wong, RS Bollampally, "Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging" Journal of Applied Polymer Science; 3396-3403 (1999)
3. Schmidt, R., "Challenges in Electronic Cooling -Opportunities for Enhanced Thermal Management Techniques - Microprocessor Liquid Cooled Minichannel Heat Sink," Heat Transfer Engineering, 25(3), 3-12 (2004)
4. F. Nakano, T. Soga, and S. Amagi, "Resin-Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices", The Proceedings of the International Society of Hybrid Microelectronics Conference, pp.536, (1987)
5. W.S. Lee, I.Y. Han, Jin Yu, S.J. Kim, K.Y. Byun, "Therma l characterization of thermally conductive underfill for a fli p-chip package using novel temperature sensing technique", Thermochimica Acta, pp.148-155, 2007. (Pubitemid 46335811)
6. H. He, R.L Fu, Y.C. Han, Y.Shen, X.F. Song, "Thermal conductivity of ceramic particle filled polymer composites and theoretical predictions", Journal of Material Science, pp6749-6754, 2007 (Pubitemid 47141887)