Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Thermochimica Acta

Volumn 455, Issue 1-2, 2007, Pages 148-155

  Lee, W S ^a   Han, I Y ^b   Yu, Jin ^b   Kim, S J ^b   Byun, K Y ^a  

^a Hynix Semiconductor Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Diamond; Diode temperature sensor array; Flip chip package; Underfill

Indexed keywords

CHIP SCALE PACKAGES; DIAMONDS; SILICA; SPECIFIC HEAT; THERMAL CONDUCTIVITY; THERMAL DIFFUSION;

DIODE TEMPERATURE SENSOR ARRAY; FLIP CHIP PACKAGE; THERMALLY CONDUCTIVE FILLERS; UNDERFILLS;

FLIP CHIP DEVICES;

EID: 33847392580     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2006.11.034     Document Type: Article

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