An improvement of thermal conductivity of underfill materials for flip-chip packages

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 25-32

  Li, Haiying ^a   Jacob, Karl I ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Carbon fiber; Encapsulants; Flip chip packages; Glass transition temperature; Silica; TCE; Underfill materials

Indexed keywords

CARBON FIBERS; COMPOSITE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC INSULATION; FILLERS; GLASS TRANSITION; SCANNING ELECTRON MICROSCOPY; SILICA; TEMPERATURE; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMOANALYSIS;

ENCAPSULANTS; FLIP-CHIP PACKAGES; STORAGE MODULUS; THERMAL EXPANSION COEFFICIENT; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0037604527     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811546     Document Type: Article

References (5)

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