Formulation of percolating thermal underfill by sequential convective gap filling

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2011 Spring Conference

Volumn , Issue , 2011, Pages 229-237

  Branschwiler, T ^a   Goicochea, J V ^a   Matsumoto, K ^b   Wolf, H ^a   Kiimin, C ^c   Michel, B ^a   Wunderle, B ^d,e   Faust, W ^e  

^a IBM RESEARCH ZURICH   (Switzerland)

^b IBM RESEARCH TOKYO   (Japan)

^c ETH ZURICH   (Switzerland)

^d CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^e FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM OXIDES; CONFINED SPACE; FILLING FRACTIONS; FILLING METHODS; ISO-PROPANOLS; MATERIAL SELECTION; SCANNING ELECTRON MICROSCOPE; SPHERICAL PARTICLE;

CHIP SCALE PACKAGES; COMPOSITE MATERIALS; CURING; EXHIBITIONS; FILLING; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SILICA; SILICON; THREE DIMENSIONAL COMPUTER GRAPHICS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84877847592     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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