A study on improvement of thermal conductivity of underfill materials for electronic packaging

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 210-215

  Li, Haiying ^a   Jacob, Karl ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBERS; CURING; ELECTRONICS PACKAGING; FILLERS; GLASS TRANSITION; SILICA; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMOANALYSIS;

ELECTRICAL CONDUCTANCE; ELECTRONIC DEVICE; ELECTRONIC PACKAGING; MECHANICAL AND THERMAL PROPERTIES; PERFORMANCE AND RELIABILITIES; THERMAL CONDUCTANCE; THERMAL EXPANSION COEFFICIENTS; UNDERFILL MATERIALS;

PACKAGING MATERIALS;

EID: 84881113957     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990388     Document Type: Conference Paper

References (4)

1. Bar-Cohen, A., Watwe, A., Seetharamu, K. N., Fundamentals of thermal management, in Fundamentals of Microsystems Packaging, Ed., Tummala, R. R. McGraw-Hill Companies, Inc. New York, NY 2001
2. ™ Symposium. Institute of Electrical and Electronic Engineers, Piscataway, NJ, 1989. pp 126-130.
3. Koh, Wei, High thermal conductance liquid encapsulants for direct chip attach, Technology Information (Dexter), May 1996.
4. Bollampally, R. S., Enhanced thermal conductivity of liquid encapsulants for electronic packaging, Master Thesis, Georgia Institute of Technology, 1998.